| PART |
Description |
Maker |
| 16190 16190-8 |
THERMAL INTERFACE PAD (MINI)
THERMAL INTERFACE PAD, (MINI)
|
VICOR[Vicor Corporation]
|
| H48-2 |
Thermal Conductive Pad
|
List of Unclassifed Manufacturers
|
| SOT545-3 |
plastic thermal enganced thin quad flat package; 48 leads; body 7 x 7 x 1 mm; exposed die pad
|
NXP Semiconductors
PHILIPS[Philips Semiconductors]
|
| TD1-2D00-031 |
Thermal Dispersion Flow/Level/Interface Switch
|
Magnetrol International, Inc.
|
| G751-2 G751-1 G751 |
Digital Temperature Sensor and Thermal Watchdog with Two-Wire Interface
|
Global Mixed-mode Technology
Electronic Theatre Controls, Inc.
ETC[ETC]
List of Unclassifed Manufacturers
|
| ZTACV ZTACV-MX-20.000 ZTTCV-MX-20.000 |
2 Pad and 3 Pad Ceramic Package, 3.1 mm x 3.7 mm
|
ILSI America LLC
|
| U6803B_05 U6803B U6803B-MFPG3Y U6803B-MFPY U6803B0 |
Triple Driver IC with Thermal Monitoring SPECIALTY INTERFACE CIRCUIT, PDSO8
|
Atmel, Corp.
ATMEL[ATMEL Corporation]
|
| AT77C104B08 AT77C104B-CB08YV AT77C104B-CB09YV AT77 |
FingerChip Thermal Fingerprint Sweep Sensor, Hardware Based, Navigation and Click Function, SPI Interface
|
ATMEL Corporation
http://
|
| FF300R12KS4P |
62mm C-Serien Modul mit schnellem IGBT2 für hochfrequentes Schalten und bereits aufgetragenem Thermal Interface Material
|
Infineon Technologies A...
|
| EMC1428-1AP-TR EMC1428-6-AP-TR EMC1428-7-AP-TRCB7 |
1°C Multiple Temperature Sensor with HW Thermal Shutdown & Hottest of Thermal Zones
|
Microchip Technology
|
