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![15-80-0089 0015800089 A-70567-0274](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
15-80-0089 0015800089 A-70567-0274
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat Molex Electronics Ltd.
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File Size |
1,218.52K /
7 Page |
View
it Online |
Download Datasheet
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![501193-0000 501940-XX07 501953-XX07 501571-XX07 501189-XX10 501334-0000 501331-XX07 501939-XX00 501568-XX07 501189-XX21](Maker_logo/molex_electronics_ltd.GIF)
Molex, Inc. http:// Molex Electronics Ltd.
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Part No. |
501193-0000 501940-XX07 501953-XX07 501571-XX07 501189-XX10 501334-0000 501331-XX07 501939-XX00 501568-XX07 501189-XX21 501189-3010 501189-4021 501190-XX17 501190-XX27 501189-2021 501330-XX00
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Description |
1.0 WtB 2-Row Rec Hsg 20Ckt 20 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE 1.0 WtB 2-Row Rec Hsg 40Ckt 40 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE 1.0 WtB 2-Row Rec Hsg 30Ckt 30 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE 1.00mm (.039) pitch wire-to-board connector 1.00mm (.039") pitch wire-to-board connector
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File Size |
905.02K /
2 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-E1-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![A-70567-0006 0015800161 15-80-0161 705670006](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
A-70567-0006 0015800161 15-80-0161 705670006
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
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File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![15-80-0141 A-70567-0005 0015800141 705670005](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
15-80-0141 A-70567-0005 0015800141 705670005
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![15-80-0121 A-70567-0004 0015800121 705670004](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
15-80-0121 A-70567-0004 0015800121 705670004
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
UPD78F0567MC(S)-XXX-CAA-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![15-80-0081 A-70567-0002 0015800081 705670002](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
15-80-0081 A-70567-0002 0015800081 705670002
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating Molex Electronics Ltd.
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File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567MC-CAA-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E2-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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