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  501940-0567 Datasheet PDF File

For 501940-0567 Found Datasheets File :: 124+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 |   

    15-80-0089 0015800089 A-70567-0274

Molex Electronics Ltd.
Part No. 15-80-0089 0015800089 A-70567-0274
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Plat
Molex Electronics Ltd.

File Size 1,218.52K  /  7 Page

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Analog Devices

Part No. 105675-HMC434
Description HMC434 Evaluation PCB
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    501193-0000 501940-XX07 501953-XX07 501571-XX07 501189-XX10 501334-0000 501331-XX07 501939-XX00 501568-XX07 501189-XX21

Molex, Inc.
http://
Molex Electronics Ltd.
Part No. 501193-0000 501940-XX07 501953-XX07 501571-XX07 501189-XX10 501334-0000 501331-XX07 501939-XX00 501568-XX07 501189-XX21 501189-3010 501189-4021 501190-XX17 501190-XX27 501189-2021 501330-XX00
Description 1.0 WtB 2-Row Rec Hsg 20Ckt 20 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
1.0 WtB 2-Row Rec Hsg 40Ckt 40 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
1.0 WtB 2-Row Rec Hsg 30Ckt 30 CONTACT(S), FEMALE, TWO PART BOARD CONNECTOR, CRIMP, RECEPTACLE
1.00mm (.039) pitch wire-to-board connector
1.00mm (.039") pitch wire-to-board connector

File Size 905.02K  /  2 Page

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Analog Devices

Part No. 105675-HMC432
Description HMC432 Evaluation PCB
Tech specs    

Official Product Page

    934056733127

NXP SEMICONDUCTORS
Part No. 934056733127
Description 12 A BUF OR INV BASED PRPHL DRVR, PSIP3

File Size 36.06K  /  6 Page

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Analog Devices

Part No. 105675-HMC433
Description HMC433 Evaluation PCB
Tech specs    

Official Product Page

    TD62583AF TD62583AP TD62583F E005674

Toshiba, Corp.
TOSHIBA[Toshiba Semiconductor]
Part No. TD62583AF TD62583AP TD62583F E005674
Description 8CH SINGLE DRIVER 8路单驱动
From old datasheet system

File Size 205.14K  /  6 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-E1-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    TD62504PA TD62503PA E005671

TOSHIBA[Toshiba Semiconductor]
Part No. TD62504PA TD62503PA E005671
Description From old datasheet system
7CH SINGLE DRIVER : COMMON EMITTER

File Size 189.62K  /  5 Page

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Renesas Electronics Corporation

Part No. UPD78F0567FC-2N2-E1-A
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    A-70567-0006 0015800161 15-80-0161 705670006

Molex Electronics Ltd.
Part No. A-70567-0006 0015800161 15-80-0161 705670006
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    15-80-0141 A-70567-0005 0015800141 705670005

Molex Electronics Ltd.
Part No. 15-80-0141 A-70567-0005 0015800141 705670005
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567FC-2N2-A
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    15-80-0121 A-70567-0004 0015800121 705670004

Molex Electronics Ltd.
Part No. 15-80-0121 A-70567-0004 0015800121 705670004
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.42K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567MC(S)-XXX-CAA-E1-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
Tech specs    

Official Product Page

    15-80-0081 A-70567-0002 0015800081 705670002

Molex Electronics Ltd.
Part No. 15-80-0081 A-70567-0002 0015800081 705670002
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.39K  /  7 Page

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Renesas Electronics Corporation

Part No. UPD78F0567MC-CAA-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

    501953-0397 501953-0417 501953-0497 501953-0507 501953-0527 501953-0537 501953-0547 501953-0567 501953-0577 501953-0587

Molex Electronics Ltd.
Part No. 501953-0397 501953-0417 501953-0497 501953-0507 501953-0527 501953-0537 501953-0547 501953-0567 501953-0577 501953-0587 501953-0597 5019530597
Description 1.0 WIRE TO BOARD CONN. WAFER ASSY 1-ROW R/A POSI-LOCK

File Size 320.02K  /  5 Page

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Renesas Electronics Corporation

Part No. UPD78F0567K8-3B4-E2-AX
Description Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
Tech specs    

Official Product Page

For 501940-0567 Found Datasheets File :: 124+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | <9> | 10 | 11 | 12 | 13 |   

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