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Molex Electronics Ltd.
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Part No. |
A-70567-0015 0015800341
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
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File Size |
1,218.42K /
7 Page |
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it Online |
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Molex Electronics Ltd.
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Part No. |
0015800145 15-80-0145 70567-0141
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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File Size |
1,218.29K /
7 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
70567-0010 A-70567-0010 0015800241
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
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File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
15-80-0129 0015800129 A-70567-0276
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.57K /
7 Page |
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it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
0015800381 70567-0017 15-80-0381
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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File Size |
1,218.40K /
7 Page |
View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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Part No. |
15-80-0125 0015800125 70567-0140
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Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla Molex Electronics Ltd.
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File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet
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Bom2Buy.com

Price and Availability
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JITONG
TECHNOLOGY
(CHINA HK & SZ)
Datasheet.hk's Sponsor |
Part: 1582595H |
Maker: MOTOROLA(摩托罗拉) |
Pack: CDIP |
Stock: 129 |
Unit price
for : |
50: $1.85 |
100: $1.75 |
1000:
$1.66 |
Email: oulindz@gmail.com |
Contact us |
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