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VISHAY INTERTECHNOLOGY INC
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| Part No. |
FCSP240LTR
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| OCR Text |
...rint area in industry. the four bump 1.5 x 1.5 mm devices can deliver up to 1.5 a and occupy only 2.3 mm 2 of board space. the anode and cathode connections are made through solder bump pads on one side of the silicon enabli ng designers t... |
| Description |
1.5 A, 40 V, SILICON, RECTIFIER DIODE
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| File Size |
132.59K /
6 Page |
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it Online |
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| Part No. |
S1D16700D01B S1D16700D00A
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| OCR Text |
...l pad chip) s1d16700d00b * (au bump chip) s1d16700d01b * (au bump chip) s1d16700t00a * (tcp) s1d16700t01a * (tcp) ? no radial rays countermeasure taken in designing
s1d16700 series 4C2 epson rev. 1.1 com0 com99 v1 v4 lcd driver 100 ... |
| Description |
LIQUID CRYSTAL DISPLAY DRIVER, UUC112
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| File Size |
85.97K /
15 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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