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Mill-Max
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| Part No. |
0912-0-00-01-00-00-03-0
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| OCR Text |
...
3114/3115
3117-1 3117-2 3117-3 3117-4 .031 .062 .094 .125 .047 .078 .110 .141
Basic Part Number 3114-1 3114-2 3115-1 3115-2 Board Thickn...0
Swage mount in .035 hole
311X-X-00-XX-00-00-08-0
Swage mount in .035 mounting hole
3112
B... |
| Description |
Solderless Pressfit PCB Pin
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| File Size |
76.50K /
1 Page |
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it Online |
Download Datasheet
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MILL-MAX MFG CORP
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| Part No. |
0351-0-15-01-34-01-10-0
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| OCR Text |
...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm... |
| Description |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
128.99K /
2 Page |
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it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
0314-0-15-01-34-01-10-0
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| OCR Text |
...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm... |
| Description |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
127.28K /
2 Page |
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it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
0436-0-57-15-03-80-10-0
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| OCR Text |
...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm... |
| Description |
BERYLLIUM COPPER, MATTE TIN (300) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
259.51K /
2 Page |
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it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
8922-0-00-15-00-00-38-0 8922-0-00-80-00-00-38-0 8922-0-00-34-00-00-38-0
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| OCR Text |
...m ? 5 1 6 - 9 2 2 - 6 0 0 0 165.3 6477-0-00-xx-00-00-38- 0 solder mount in 0,86 mounting hole 6477 9086-0-00-xx-00-00-33- 0 solder mount in 1,02 mounting hole 9086 4477-0-00-xx-00-00-33- 0 solder mount in 0,86 mounting hole 4... |
| Description |
BRASS, GOLD (10) OVER NICKEL FINISH, PCB TERMINAL
BRASS, TIN (200) OVER NICKEL FINISH, PCB TERMINAL
BRASS, GOLD (50) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
70.57K /
1 Page |
View
it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
0969-0-40-20-75-14-26-0
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| OCR Text |
...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm... |
| Description |
COPPER ALLOY, GOLD (20) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
220.71K /
1 Page |
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it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
4184-0-00-21-00-00-33-0
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| OCR Text |
...1000c/930c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is permitted by ec directive 2002/95annex 6; so all pin materials are rohs compliant) *international annealed copper standard, i.e. as a % of pure copper. ... |
| Description |
PHOSPHOR BRONZE, GOLD (20) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
85.49K /
2 Page |
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it Online |
Download Datasheet |
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MILL-MAX MFG CORP
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| Part No. |
0285-0-15-01-16-01-10-0
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| OCR Text |
...osition: cu 61.5%, zn 35.4%, pb 3.1%? hardness as machined: 80-90 rockwell b density: .307 lbs/in3 electrical conductivity: 26% iacs* melting point: 900c/885c (liquidus/solidus) ?(3 to 4% lead is used to permit "free machining" and is perm... |
| Description |
BERYLLIUM COPPER, TIN LEAD (200) OVER NICKEL FINISH, PCB TERMINAL
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| File Size |
125.40K /
2 Page |
View
it Online |
Download Datasheet |
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