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561510 C68HC 272MA3 B3916 AN131 IRF746 272MA3 C68HC
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    HSDL-3208-021 HSDL3208

Agilent (Hewlett-Packard)
HP[Agilent(Hewlett-Packard)]
Part No. HSDL-3208-021 HSDL3208
OCR Text ...0 t-TIME (SECONDS) P2 SOLDER paste DRY Figure 13. Reflow graph. Process Zone Heat Up Solder paste Dry Solder Reflow Symbol P1, R1 P2, R2 P3, R3 P3, R4 T 25C to 125C 125C to 170C 170C to 230C (245C at 10 seconds max.) 230C to ...
Description Ultra Small Profile Package IrDA Data Compliant Low Power 115.2 kbit/s Infrared Transceiver

File Size 261.57K  /  18 Page

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    TriQuint Semiconductor,Inc.
Part No. TGA2924-SG
OCR Text ...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not ...
Description 10 Watt MMDS Packaged Amplifier

File Size 270.25K  /  11 Page

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    TriQuint Semiconductor, Inc.
Part No. TGA2924-SG-T/R
OCR Text ...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors? recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering i...
Description
File Size 376.46K  /  12 Page

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    TGA2503-SM

TriQuint Semiconductor
Part No. TGA2503-SM
OCR Text ...mends using a conductive solder paste for attachment. follow solder paste and reflow oven vendors recommendations when developing a solder reflow profile. typical solder reflow profiles are listed in the table below. hand soldering is not ...
Description 32 dBm Ku-Band Amplifier

File Size 152.54K  /  11 Page

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    IP4364CX8

NXP Semiconductors
Part No. IP4364CX8
OCR Text ...quires several steps: 1. solder paste printing on the pcb 2. component placement with a pick and place machine 3. the re?ow soldering itself 9.3 re?ow soldering key characteristics in re?ow soldering are: ? lead-free versus snpb soldering; ...
Description (IP4064CX8 / IP4364CX8) Integrated SIM card passive filter array

File Size 116.61K  /  13 Page

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    Infineon Technologies A...
Part No. F3L300R12ME4-B23
OCR Text ...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,0300 k/w temperaturimschaltbetrieb temperatureunderswitchingconditions t vj op -40 150 c j 3 technischeinformation/technicalinformation f3...
Description EconoDUAL3 Modul mit Trench/Feldstopp IGBT4 und Emitter Controlled HE Diode und NTC

File Size 601.22K  /  11 Page

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    CL-L251-MC6WW1-C

CITIZEN ELECTRONICS CO., LTD.
Part No. CL-L251-MC6WW1-C
OCR Text ... however, the use of insulating paste is strongly recommended in order to avoid short circuit. this product could be bent during the clamping operation if heat grease in sheet form is used. for this reason, it is recommended that g...
Description LED lamp

File Size 235.12K  /  9 Page

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    PESD5V0U1BA

Philips Semiconductors
Part No. PESD5V0U1BA
OCR Text ...der resist occupied area solder paste msa415 1.40 4.40 5.00 1.20 2.75 preferred transport direction during soldering solder lands solder resist occupied area pesd5v0u1ba_bb_bl_1 ? nxp b.v. 2007. all rights reserved. product data sheet r...
Description (PESD5V0U1Bx) Ultra low capacitance bidirectional ESD protection diodes

File Size 112.62K  /  12 Page

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    CL-L251-MC6W1-C

CITIZEN ELECTRONICS CO., LTD.
Part No. CL-L251-MC6W1-C
OCR Text ... however, the use of insulating paste is strongly recommended in order to avoid short circuit. this product could be bent during the clamping operation if heat grease in sheet form is used. for this reason, it is recommended that g...
Description LED lamp

File Size 241.08K  /  9 Page

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    CL-L251-MC6N1-C

CITIZEN ELECTRONICS CO., LTD.
Part No. CL-L251-MC6N1-C
OCR Text ... however, the use of insulating paste is strongly recommended in order to avoid short circuit. this product could be bent during the clamping operation if heat grease in sheet form is used. for this reason, it is recommended that g...
Description LED lamp

File Size 227.30K  /  9 Page

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