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  90136-1108 Datasheet PDF File

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    90136-1130 0901361130

Molex Electronics Ltd.
Part No. 90136-1130 0901361130
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

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Amphenol Communications Solutions

Part No. 69190-136HLF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0901361304 90136-1304

Molex Electronics Ltd.
Part No. 0901361304 90136-1304
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 4 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.51K  /  4 Page

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Amphenol Communications Solutions

Part No. 78290-136HLF
Description BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
Tech specs    

Official Product Page

    0901361303 90136-1303

Molex Electronics Ltd.
Part No. 0901361303 90136-1303
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 3 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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Amphenol Communications Solutions

Part No. 68690-136HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0901361302 90136-1302

Molex Electronics Ltd.
Part No. 0901361302 90136-1302
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 2 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.50K  /  4 Page

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    0901361301 90136-1301

Molex Electronics Ltd.
Part No. 0901361301 90136-1301
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 1 Circuit, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 159.74K  /  4 Page

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    0901362208 90136-2208

Molex Electronics Ltd.
Part No. 0901362208 90136-2208
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Right Angle, Shrouded, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating
MOLEX Connector

File Size 254.60K  /  5 Page

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    0901361332

Molex Electronics Ltd.
Part No. 0901361332
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.41K  /  5 Page

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    0901361330

Molex Electronics Ltd.
Part No. 0901361330
Description 2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 30 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 254.41K  /  5 Page

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    90136-1132 0901361132

Molex Electronics Ltd.
Part No. 90136-1132 0901361132
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 32 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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    90136-1112 0901361112

Molex Electronics Ltd.
Part No. 90136-1112 0901361112
Description 2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 12 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)

File Size 159.24K  /  4 Page

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