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![A-70567-0344 15-80-1121 0015801121](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
A-70567-0344 15-80-1121 0015801121
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
![A-70567-0346 15-80-1161 0015801161](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
A-70567-0346 15-80-1161 0015801161
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
![A-70567-0348 15-80-1201 0015801201](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
A-70567-0348 15-80-1201 0015801201
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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File Size |
1,218.35K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![A-70567-0358 15-80-1401 0015801401](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
A-70567-0358 15-80-1401 0015801401
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-E1-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![0015800205 15-80-0205 70567-0144](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0015800205 15-80-0205 70567-0144
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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File Size |
1,218.25K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567FC-2N2-A
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![0015800207 15-80-0207 A-70567-0212](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0015800207 15-80-0207 A-70567-0212
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, Tin (Sn) Plating
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File Size |
1,218.31K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567MC(S)-XXX-CAA-E1-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
![0015800209 15-80-0209 A-70567-0280](Maker_logo/molex_electronics_ltd.GIF)
Molex Electronics Ltd.
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Part No. |
0015800209 15-80-0209 A-70567-0280
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Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
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File Size |
1,218.34K /
7 Page |
View
it Online |
Download Datasheet
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567MC-CAA-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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![](images/bg04.gif) |
Renesas Electronics Corporation |
Part No. |
UPD78F0567K8-3B4-E2-AX
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Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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