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  NJM2801-0543 Datasheet PDF File

For NJM2801-0543 Found Datasheets File :: 147+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    70543-0002 0705430002

Molex Electronics Ltd.
Part No. 70543-0002 0705430002
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 3Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.27K  /  4 Page

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Renesas Electronics Corporation

Part No. 5962-9054302MQA
Description CMOS High Performance Programmable DMA Controller
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0705430106

Molex Electronics Ltd.
Part No. 0705430106
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 2 Circuits, 0.76um (30u)

File Size 418.23K  /  4 Page

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Renesas Electronics Corporation

Part No. R7F7010543AFP
Description High-end In-vehicle Microcomputers for Body Applications
Tech specs    

Official Product Page

    0705430108

Molex Electronics Ltd.
Part No. 0705430108
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 4Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.27K  /  4 Page

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Renesas Electronics Corporation

Part No. LVC60543AU
Description 16BIT BUFF / DRIVER
Tech specs    

Official Product Page

    0705430109

Molex Electronics Ltd.
Part No. 0705430109
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, Shrouded34 Circuits, Tin (Sn) Plating, without Press-fit Plastic Pegs

File Size 418.27K  /  4 Page

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Renesas Electronics Corporation

Part No. LVC60543U
Description 16BIT BUFF / DRIVER
Tech specs    

Official Product Page

    0705430110

Molex Electronics Ltd.
Part No. 0705430110
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 6Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.24K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-433HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 33 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

    0705430111

Molex Electronics Ltd.
Part No. 0705430111
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 7Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68405-436HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0705430113

Molex Electronics Ltd.
Part No. 0705430113
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 9Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68405-432HLF
Description BergStik®, Board to Board connector, Unshrouded Right Angled Header, Through Hole, Double Row, 32 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

    0705430112

Molex Electronics Ltd.
Part No. 0705430112
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 8Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.23K  /  4 Page

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Amphenol Communications Solutions

Part No. 61128-0543LF
Description Header, Top Mount, Upper Deck(68Pins), 3.3V, 4.3mm s/o
Tech specs    

Official Product Page

    0705430121

Molex Electronics Ltd.
Part No. 0705430121
Description 2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, 17Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. DDR4288S0543HF
Description DDR4 SMT
Tech specs    

Official Product Page

    70543-0009 0705430009

Molex Electronics Ltd.
Part No. 70543-0009 0705430009
Description 2.54mm (.100) Pitch C-Grid? Header, Surface Mount, Dual Row, Vertical, 24 Circuits1.50μm (59μ) Minimum Bright Tin (Sn) Over Nickel (Ni) Plating, without PCB Locator

File Size 418.15K  /  4 Page

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Amphenol Communications Solutions

Part No. 68705-435HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 35 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
Tech specs    

Official Product Page

For NJM2801-0543 Found Datasheets File :: 147+       Page :: | 1 | 2 | 3 | 4 | 5 | <6> | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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