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Molex Electronics Ltd.
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| Part No. |
0015800181 70567-0007 A-70567-0007 15-80-0181
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 18 Circuits, Tin (Sn) Plating
MOLEX Connector
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| File Size |
1,218.43K /
7 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0015800381 70567-0017 15-80-0381
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 38 Circuits, Tin (Sn) Plating
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| File Size |
1,218.40K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-E1-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0349 15-80-1221 0015801221
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567FC-2N2-E1-A
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567FC-2N2-A
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567MC(S)-XXX-CAA-E1-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0341 15-80-1061 0015801061
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 6 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.39K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567MC-CAA-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
A-70567-0343 15-80-1101 0015801101
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold, (Au) Selective Pla
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold, (Au) Selective Plating
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| File Size |
1,218.38K /
7 Page |
View
it Online |
Download Datasheet |
| |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-E2-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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