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				Molex Electronics Ltd.
Part No.	0702871100
OCR Text	... - maximum 250v dc solder process data duration at max. process temperature (seconds) 5 lead-free process capability wave capable (th only) max. cycles at max. process temperature 1 process temperatur...
Description	2.54mm (.100) Pitch C-Grid? Header, Breakaway, Dual Row, Vertical, with RetentionPin, 8 Circuits, 6.10mm (.240) Mating Pin Length, 0.38μm (15μ) Gold (Au) Selective
File Size	308.36K / 6 Page	View it Online	Download Datasheet

				Fujitsu Component Limited.
Part No.	MB90V485B
OCR Text	...or microcontroller designed for process control in consumer devices and other app lications requiring high-speed real-time processing. the f 2 mc-16lx cpu core instruction set retains the at architecture of the f 2 mc* 1 family, with addit...
Description	16-bit Microcontroller
File Size	727.55K / 124 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP788X
OCR Text	process details principal device type cmkt5087 gross die per 5 inch wafer 91,469 process cp788x small signal transistor pnp - low noise amplifier transistor chip process epitaxial planar die size 13.7 x 13.7 mils die thickne...
Description	Small Signal Transistor PNP - Low Noise Amplifier Transistor Chip
File Size	699.02K / 2 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	46409-1100
OCR Text	...ting -10c to +105c solder process data duration at max. process temperature (seconds) 40 lead-free process capability smc & wave capable (th only) max. cycles at max. process temperature 3 process ...
Description	PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
File Size	61.81K / 1 Page	View it Online	Download Datasheet

				Molex Electronics Ltd.
Part No.	46408-1100
OCR Text	...ting -10c to +105c solder process data duration at max. process temperature (seconds) 40 lead-free process capability smc & wave capable (th only) max. cycles at max. process temperature 3 process ...
Description	PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
File Size	63.33K / 2 Page	View it Online	Download Datasheet

				Vishay
Part No.	VJX8R
OCR Text	...frequency stability ? wet build process ? reliable noble metal electrode (nme) system ? compliant to rohs directive 2002/95/ec ? halogen-free according to iec 61249-2-21 definition applications ? high temperature modules electrical specif...
Description	Surface Mount Multilayer Ceramic Chip Capacitors
File Size	143.31K / 5 Page	View it Online	Download Datasheet

				centralsemi
Part No.	CPD69
OCR Text	process details principal device types cmr1-02 series cmr1-02m series cxr1-04 cxr1-04c czr1-04 czr1-04c gross die per 4 inch wafer 6,200 process cpd69 general purpose rectifier 1 amp glass passivated rectifier chip process ...
Description	1 Amp Glass Passivated Rectifier Chip
File Size	415.74K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP757X
OCR Text	process cp757x small signal mosfet transistor p-channel enhancement-mode mosfet chip process details die size 22 x 17 mils die thickness 5.9 mils gate bonding pad area 3.9 x 3.9 mils source bonding pad area 14 x 9 mils to...
Description	Small Signal MOSFET Transistor P-Channel Enhancement-Mode MOSFET Chip
File Size	738.31K / 2 Page	View it Online	Download Datasheet

				Central Semiconductor Corp
Part No.	CP379X
OCR Text	process cp379x small signal mosfet transistor n-channel enhancement-mode transistor chip process details die size 31.5 x 31.5 mils die thickness 5.5 mils gate bonding pad area 3.9 x 3.9 mils source bonding pad area 19.3 x ...
Description	Small Signal MOSFET Transistor N-Channel Enhancement-Mode Transistor Chip
File Size	745.81K / 2 Page	View it Online	Download Datasheet

For process Found Datasheets File :: 91178 Search Time::1.109ms
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