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D1388 STPS1L4 TEW5039 PE9436 MCHC908 75002 AT42085 D1667
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    FS225R12KE3

Infineon Technologies AG
Part No. FS225R12KE3
OCR Text ...heatsink proigbt/perigbt l paste =1w/(mk)/ l grease =1w/(mk) r thch 0,047 k/w 2 technischeinformation/technicalinformation fs225r12ke3 igbt-module igbt-modules preparedby:mb approvedby:wr dateofpublication:...
Description Technische Information / Technical Information

File Size 576.17K  /  9 Page

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    AVAGO
Part No. ACPM-5013
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description Power Amplifier Module

File Size 312.26K  /  14 Page

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    MILL-MAX MFG CORP
Part No. 4015-0-65-80-30-80-10-0
OCR Text ... barrier which prevents solder, paste or flux from contaminating the spring contact. after soldering, the ofp? barrier is pushed out of the receptacle when the device is plugged in. ? also new for mill-max is the availability of rohs lead ...
Description BERYLLIUM COPPER ALLOY, TIN FINISH, PCB TERMINAL

File Size 225.07K  /  2 Page

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    ACPM-5205-BLK

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5205-BLK
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description UMTS Band5 (824-849MHz) 3x3mm Power Amplifier Module

File Size 276.40K  /  13 Page

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    ACPM-5005-BLK ACPM-5005-TR1

AVAGO TECHNOLOGIES LIMITED
Part No. ACPM-5005-BLK ACPM-5005-TR1
OCR Text ...tion solder mask opening solder paste stencil aperture pcb design guidelines the recommended pcb land pattern is shown in figures on the left side. the substrate is coated with solder mask between the i/o and conductive paddle to protect ...
Description Multimode PA - UMTS Band5 and CDMA Cellular (815-849MHz) 3x3mm Power Amplifier Module with Coupler

File Size 278.09K  /  13 Page

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    AVAGO
Part No. WS1105
OCR Text ...ensure optimum amount of solder paste is deposited onto the pcb pads. the recommended stencil layout is shown in figure 16. reducing the stencil opening can potentially generate more voids. on the other hand, stencil openings larger tha...
Description CDMA Cell 3x3 Power Amplifier Module

File Size 232.26K  /  15 Page

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    AVAGO
Part No. WS1103
OCR Text ...ensure optimum amount of solder paste is deposited onto the pcb pads. the recommended stencil layout is shown in figure 16. reducing the stencil opening can potentially generate more voids. on the other hand, stencil openings larg...
Description CDMA Cell 3x3 Power Amplifier Module

File Size 291.61K  /  15 Page

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    USBULC1606-4M8

STMicroelectronics
Part No. USBULC1606-4M8
OCR Text ...5 doc id 16864 rev 1 4.2 solder paste 1. halide-free flux qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste is recommended. 3. offers a high tack force to resist component movement during high speed. 4. solder ...
Description Ultra low capacitance ESD protection for enhanced mini USB interface

File Size 399.85K  /  15 Page

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    MARL INTERNATIONAL LTD
Part No. CL-L251-C6N1-C
OCR Text ... however, the use of insulating paste is strongly recommended in order to avoid short circuit. this product could be bent during the clamping operation if heat grease in sheet form is used. for this reason, it is recommended that g...
Description SINGLE COLOR DISPLAY CLUSTER, WHITE, 10 mm

File Size 235.01K  /  9 Page

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