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  87914-0616 Datasheet PDF File

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    87914-2616 0879142616

Molex Electronics Ltd.
Part No. 87914-2616 0879142616
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 26 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 75844-879-14LF
Description BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Double Row, 14 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0879143435 87914-3435

Molex Electronics Ltd.
Part No. 0879143435 87914-3435
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 34 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plating, Tray Packaging, Lead-free

File Size 3,776.94K  /  48 Page

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Renesas Electronics Corporation

Part No. RJE0616JSP-00#J0
Description –60V, –10A, P Channel Thermal FET Power Switching
Tech specs    

Official Product Page

    87914-8016 0879148016

Molex Electronics Ltd.
Part No. 87914-8016 0879148016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 80 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 87061-605LF
Description Quickie® IDC Cable-to-Board Connector System, Eject Latch Header, Through Hole, Right Angle, Double Row, Stacked 4 Wall, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    0879145016 87914-5016

Molex Electronics Ltd.
Part No. 0879145016 87914-5016
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 50 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.55K  /  48 Page

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Amphenol Communications Solutions

Part No. 98414-G06-16LF
Description Minitek®, Board/Wire to Board Connectors, Shrouded Header - Through Mount - Double row - 16 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    0879144405 87914-4405

Molex Electronics Ltd.
Part No. 0879144405 87914-4405
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 0.76μm (30μ) Gold (Au) Plating, Tray Packaging, Lead-free

File Size 4,415.94K  /  57 Page

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Amphenol Communications Solutions

Part No. 68020-616
Description BergStik®, Board to Board connector, Unshrouded Right angled Header, Through Hole, Double Row, 16 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    87914-2816 0879142816

Molex Electronics Ltd.
Part No. 87914-2816 0879142816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 28 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.54K  /  48 Page

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Amphenol Communications Solutions

Part No. 57102-G06-16LF
Description Minitek®, Board/Wire to Board Connectors, Unshrouded Headers - Through Hole - Double row - 32 Positions - 2mm (0.079inch) - Vertical
Tech specs    

Official Product Page

    87914-3816 0879143816

Molex Electronics Ltd.
Part No. 87914-3816 0879143816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 38 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 61082-061622LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

    0879140816

Molex Electronics Ltd.
Part No. 0879140816
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 8 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 51940-616LF
Description PwrBlade®, Power Supply Connectors, 3ACP 8S 4P Vertical Receptacle.
Tech specs    

Official Product Page

    0879144416 87914-4416

Molex Electronics Ltd.
Part No. 0879144416 87914-4416
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 44 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.22K  /  48 Page

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Amphenol Communications Solutions

Part No. 10130616-067RDLF
Description PCIe M.2 Connectors, Storage and Server Connector, P=0.5mm, H4.2mm, Key M, 30u\\ Au Plating .
Tech specs    

Official Product Page

    0879142016

Molex Electronics Ltd.
Part No. 0879142016
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 20 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free

File Size 3,779.31K  /  48 Page

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Amphenol Communications Solutions

Part No. 61082-061600LF
Description BergStak® 0.80mm Pitch, Receptacle, Vertical, Double Row, 60 Positions.
Tech specs    

Official Product Page

For 87914-0616 Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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