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Renesas Electronics Corporation |
Part No. |
2SC2734
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Description |
Small Signal Bip-TRSs for High Frequency Amplifier, , /
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Tech specs |
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Official Product Page
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International Business Machines, Corp.
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Part No. |
IBM13M32734BCB
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Description |
32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)
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File Size |
196.87K /
20 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
UPA2734GR-E2-AT
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Description |
Switching N-Channel Power MOSFET, SOP, /Embossed Tape
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Tech specs |
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Official Product Page
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International Business Machines, Corp.
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Part No. |
IBM13M32734BCA
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Description |
32M x 72 2-Bank Registered SDRAM Module(32M x 72 2组寄存同步动态RAM模块) 32M × 72配置2,银行注册内存模块(32M × 72配置2组寄存同步动态内存模块)
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File Size |
224.46K /
20 Page |
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it Online |
Download Datasheet
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Renesas Electronics Corporation |
Part No. |
UPA2734GR-E1-AT
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Description |
Switching N-Channel Power MOSFET
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Tech specs |
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Official Product Page
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IBM Microeletronics International Business Machines, Corp.
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Part No. |
IBM13M32734BCD
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Description |
32M x 72 2-Bank Registered/Buffered SDRAM Module(32M x 72 2组寄缓冲同步动态RAM模块) 32M × 72配置2,银行注缓冲内存模组2M × 72配置2组寄缓冲同步动态内存模块)
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File Size |
200.35K /
20 Page |
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it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
77313-827-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 34 Positions
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Tech specs |
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Official Product Page
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International Business Machines, Corp.
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Part No. |
IBM13Q32734BCA-10Y
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Description |
x72 SDRAM Module 32M x 72 Registered SDRAM Module(32M x 72 200脚寄存同步动态RAM模块) 32M × 72配置注册内存模块2M × 72配置200脚寄存同步动态内存模块)
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File Size |
112.61K /
15 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
77313-427-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 34 Positions
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-127-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77311-827-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
77313-127-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded Header, 2.54 mm Pitch, Vertical, Double Row,Through Hole, 34 Positions
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Tech specs |
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Official Product Page
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Yageo, Corp.
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Part No. |
232273463839L 232273081112 232273081112L
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Description |
RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 1 %, 100 ppm, 38.3 ohm, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT RESISTOR, METAL GLAZE/THICK FILM, 0.125 W, 5 %, 100 ppm, 1100 ohm, SURFACE MOUNT, 0805 CHIP, ROHS COMPLIANT
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File Size |
291.74K /
8 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
77311-427-34LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical Header, Through Hole, Single Row, 34 Positions, 2.54 mm Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54112-827344250LF
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Description |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 34 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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(CHINA HK & SZ)
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Part: 2703K |
Maker: NEC |
Pack: SOP4P |
Stock: 80 |
Unit price
for : |
50: $0.55 |
100: $0.53 |
1000:
$0.50 |
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