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  09-01-6181 Datasheet PDF File

For 09-01-6181 Found Datasheets File :: 114+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

    VG2618165CJ-4

Vanguard International Semiconductor
Part No. VG2618165CJ-4
Description Vanguard International Semiconductor Corporation (VIS)

File Size 258.90K  /  28 Page

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Amphenol Communications Solutions

Part No. 10137926-1811LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    VG2618160CJ-5

Vanguard International Semiconductor
Part No. VG2618160CJ-5
Description DRAM Chip, FPM DRAM, 2MByte, 5V Supply, Commercial, SOJ, 42-Pin

File Size 323.23K  /  25 Page

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Amphenol Communications Solutions

Part No. 10156618-1500LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 15 positions
Tech specs    

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    VG2618165CJ-5

Vanguard International Semiconductor
Part No. VG2618165CJ-5
Description DRAM Chip, EDO DRAM, 2MByte, 5V Supply, Commercial, SOJ, 42-Pin

File Size 368.81K  /  28 Page

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Amphenol Communications Solutions

Part No. RJE7B1886181
Description Modular Jack - 8P8C, Right Angle, Cat6A, THT, Yellow Housing, Recessed Profile, Single Port, Shield With No EMI Tabs, With LEDs
Tech specs    

Official Product Page

    VG2618165DJ-5

Vanguard International Semiconductor
Part No. VG2618165DJ-5
Description DRAM Chip, EDO DRAM, 2MByte, 5V Supply, Commercial, SOJ, 42-Pin

File Size 327.48K  /  26 Page

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Amphenol Communications Solutions

Part No. 10137926-1812LF
Description Minitek® Pwr 3.0, Dual Row, Vertical SMT Tails and Hold Down Header, Tin plating, Black Color, 18 Positions, Non GW Compatible LCP, Tape and Reel with cap.
Tech specs    

Official Product Page

    Vanguard Microelectronics Limited
Part No. VG2618160CJ
Description CMOS DRAM

File Size 498.79K  /  25 Page

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Amphenol Communications Solutions

Part No. 131-4618-11D
Description Paladin® 112Gb/s Backplane Connector, 4-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, Nickel Sulfamate.
Tech specs    

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    Infineon Technologies A...
Part No. MA000361814
Description Material Content Data Sheet

File Size 23.65K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-3618-11H
Description Paladin® 112Gb/s Backplane Connector, 3-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    PE-96161 PE-96173 PE-96175 PE-96178 PE-96187 PE-96168 PE-96187NL PE-96188 PE-96165 PE-96186 PE-96177 PE-96181 PE-96179

List of Unclassifed Manufacturers
Pulse Engineering, Inc.
Part No. PE-96161 PE-96173 PE-96175 PE-96178 PE-96187 PE-96168 PE-96187NL PE-96188 PE-96165 PE-96186 PE-96177 PE-96181 PE-96179
Description 500 kHz COMMON MODE EMI INDUCTORS

File Size 75.39K  /  1 Page

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Amphenol Communications Solutions

Part No. 131-8618-11H
Description Paladin® 112Gb/s Backplane Connector, 8-Pair, 8 Column, Right Polarized, Backplane Module, 1.5mm Wipe, APP.
Tech specs    

Official Product Page

    EN61810-1 EN60950-1 EN60730-1 EN60335-1 EN60065

Fujitsu Component Limited.
Part No. EN61810-1 EN60950-1 EN60730-1 EN60335-1 EN60065
Description POWER RELAY 2 POLE - 5A - 1.5mm contact gap

File Size 243.82K  /  7 Page

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Amphenol Communications Solutions

Part No. 10156618-1200LF
Description Minitek® Board-In, Wire to Board Connectors, Vertical housing 2.50mm 12 positions
Tech specs    

Official Product Page

    Vanguard Microelectronics Limited
Part No. VG2618165C VG26V18165C
Description CMOS DRAM

File Size 629.99K  /  26 Page

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Amphenol Communications Solutions

Part No. RJE722886181
Description Modular Jack - 8P8C, Right Angle, Cat5e, Two Port, Shield With No EMI Tabs, Recessed Profile, With LEDs
Tech specs    

Official Product Page

    A67L93361 A67L93361E-8.5F A67L06181 A67L06181E A67L06181E-10.0 A67L06181E-10.0F A67L06181E-7.5 A67L06181E-7.5F A67L06181

AMIC Technology, Corp.
AMIC Technology Corporation
AMICC[AMIC Technology]
Part No. A67L93361 A67L93361E-8.5F A67L06181 A67L06181E A67L06181E-10.0 A67L06181E-10.0F A67L06181E-7.5 A67L06181E-7.5F A67L06181E-8.5 A67L06181E-8.5F A67L93361E A67L93361E-10.0 A67L93361E-10.0F A67L93361E-7.5 A67L93361E-7.5F A67L93361E-8.5
Description 1M X 18, 512K X 36 LVTTL, Flow-through ZeBL SRAM 100万X 18,为512k × 36 LVTTL,流通过ZeBL的SRAM
Hook-Up Wire; Conductor Size AWG:18; Approval Categories:J-W-1177/14; MW 35C (Heavy); Jacket Material:Polyester; Leaded Process Compatible:Yes; Number of Conductors:1; Voltage Nom.:600V RoHS Compliant: Yes
Hook-Up Wire; Conductor Size AWG:20; No. Strands x Strand Size:Solid; Approval Categories:J-W-1177/14; MW 35C (Heavy); Jacket Material:Polythermaleze; Leaded Process Compatible:Yes; Number of Conductors:1; Voltage Nom.:600V RoHS Compliant: Yes
(A67L06181 / A67L93361) Flow-through ZeBL SRAM

File Size 240.99K  /  18 Page

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Amphenol Communications Solutions

Part No. RJSGE4886181
Description Modular Jack - 8P8C, Right Angle, Cat5e, Four Port, Stacked, 2x2, Shield With No EMI Tabs, With LEDs, Press-fit Contacts
Tech specs    

Official Product Page

For 09-01-6181 Found Datasheets File :: 114+       Page :: | 1 | 2 | 3 | 4 | <5> | 6 | 7 | 8 | 9 | 10 | 11 | 12 |   

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