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  01580 Datasheet PDF File

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    0015800445 15-80-0445

Molex Electronics Ltd.
Part No. 0015800445 15-80-0445
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 44 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015803AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800725

Molex Electronics Ltd.
Part No. 0015800725
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 72 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.15K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015804AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

    0015800561

Molex Electronics Ltd.
Part No. 0015800561
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, Tin (Sn) Plating

File Size 1,218.23K  /  7 Page

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    15-80-0403 0015800403

Molex Electronics Ltd.
Part No. 15-80-0403 0015800403
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits

File Size 1,218.28K  /  7 Page

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    0015800343

Molex Electronics Ltd.
Part No. 0015800343
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits

File Size 1,218.29K  /  7 Page

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    15-80-0621 0015800621

Molex Electronics Ltd.
Part No. 15-80-0621 0015800621
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 62 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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    0015800263

Molex Electronics Ltd.
Part No. 0015800263
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.25K  /  7 Page

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    15-80-0323 0015800323

Molex Electronics Ltd.
Part No. 15-80-0323 0015800323
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 32 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    0015800243

Molex Electronics Ltd.
Part No. 0015800243
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits

File Size 1,218.29K  /  7 Page

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    0015800225

Molex Electronics Ltd.
Part No. 0015800225
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating

File Size 1,218.29K  /  7 Page

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