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For thin-chip Found Datasheets File :: 9432 Search Time::1.891ms
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				Advanced Micro Devices, Inc.
Part No.	AM29F016B-70E4EB AM29F016B-70F4E AM29F016B-70F4EB AM29F016B-70F4IB AM29F016B-70FIB AM29F016B-70ECB AM29F016B-70EEB AM29F016B-70E4C AM29F016B-70E4IB AM29F016B-70EI AM29F016B-70F4C AM29F016B-70FCB
OCR Text	... +125c) package type e = 48-pin thin small outline package (tsop) standard pinout (ts 048) f = 48-pin thin small outline package (tsop) ...chip, or suspending/resuming the erase operation. after the system writes the autoselect command se-...
Description	16 Megabit (2 M x 8-Bit) CMOS 5.0 Volt-only, Uniform Sector Flash Memory LM3354 Regulated 90mA Buck-Boost Switched Capacitor DC/DC Converter; Package: MINI SOIC; No of Pins: 10; Qty per Container: 1000; Container: Reel CAP 82PF 100V 2% NP0(C0G) SMD-0603 TR-7 PLATED-NI/SN LM3352 Regulated 200 mA Buck-Boost Switched Capacitor DC/DC Converter; Package: TSSOP; No of Pins: 16; Qty per Container: 92; Container: Rail TOOL INSERTION PLIER METAL PT LM3354 Regulated 90mA Buck-Boost Switched Capacitor DC/DC Converter; ; Qty per Container: 1 Am29F016B KGD (Known Good Die) Supplement
File Size	250.65K / 38 Page	View it Online	Download Datasheet

				Freescale (Motorola) MOTOROLA[Motorola, Inc] MOTOROLA[Motorola Inc]
Part No.	MPXV2010DP MPXV2010GP MPX2010 MPX2010D MPX2010DP MPX2010GP MPX2010GS MPX2010GSX
OCR Text	...n die with the strain gauge and thin-film resistor network integrated on each chip. The sensor is laser trimmed for precise span, offset calibration and temperature compensation. UNIBODY PACKAGE MPX2010 MPXV2010G SERIES Motorola Prefer...
Description	Compensated Pressure Sensor 10 KPA ON CHIP TEMPERATURE COMPENSATED CALIBRATED SILICON PRESSURE SENSORS
File Size	310.65K / 12 Page	View it Online	Download Datasheet

				List of Unclassifed Manufacturers ETC[ETC] N.A.
Part No.	ACX706AKM
OCR Text	.../A converter, a newly-developed thin high-efficiency LED front light, and a touch panel optimized for use with reflective LCD panels. The re...chip in the newly-developed CXD3513GG for simplification of the total system. QVGA reflective color...
Description	Portrait-type 8.9 cm (3.5-type) QVGA Reflective Color LCD Module with Built-in Touch Panel and 4-bit D/A Converter
File Size	49.77K / 2 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC451
OCR Text	...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description	GaAs PHEMT MMIC MEDIUM POWER AMPLIFIER, 5.0 - 20.0 GHz
File Size	343.24K / 8 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC516
OCR Text	...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 7 - 17 GHz
File Size	289.37K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation Hittite Microwave Corpo...
Part No.	HMC55409
OCR Text	...n 0.127mm (5 mil) thick alumina thin fi lm substrates are recommended for bringing rf to and from the chip (figure 1). if 0.254mm (10 mil) thick alumina thin fi lm substrates must be used, the die should be raised 0.150mm (6 mils) so t...
Description	GaAs MMIC FUNDAMENTAL MIXER, 11 - 20 GHz
File Size	225.93K / 6 Page	View it Online	Download Datasheet

				SGS Thomson Microelectronics
Part No.	AN483
OCR Text	...current ic de- sign lies in the thin wires that connect the silicon chip itself to the external connections of the ic package. these bonding wires are typically fine gold wires (up to 50um thick) which cannot carry more than a few amperes o...
Description	MIXED WIRE BONDING TECHNOLOGY FOR AUTOMOTIVE SMART POWER ICs
File Size	307.34K / 4 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC517
OCR Text	...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 17 - 26 GHz
File Size	286.67K / 6 Page	View it Online	Download Datasheet

				Hittite Microwave Corporation
Part No.	HMC518
OCR Text	...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description	GaAs PHEMT MMIC LOW NOISE AMPLIFIER, 20 - 32 GHz
File Size	291.06K / 6 Page	View it Online	Download Datasheet

For thin-chip Found Datasheets File :: 9432 Search Time::1.891ms
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