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leadframe Datasheet PDF File

For leadframe Found Datasheets File :: 6443 Search Time::0.704ms
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				IRF[International Rectifier]
Part No.	IRF7389 IRF7389TR
OCR Text	...n modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dram...
Description	Generation v technology 30V Dual N- and P- Channel HEXFET Power MOSFET in a SO-8 package
File Size	210.72K / 10 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF7401 IRF7402 IRF7401TR
OCR Text	...n modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dram...
Description	20V Single N-Channel HEXFET Power MOSFET in a SO-8 package HEXFET? Power MOSFET Power MOSFET(Vdss=20V, Rds(on)=0.022ohm) Power MOSFET(Vdss=20V/ Rds(on)=0.022ohm)
File Size	117.75K / 9 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF7403 IRF7403TRPBF
OCR Text	...n modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dram...
Description	Generation V Technology Power MOSFET
File Size	112.84K / 9 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IRF7404
OCR Text	...n modified through a customized leadframe for enhanced thermal characteristics and multiple-die capability making it ideal in a variety of power applications. With these improvements, multiple devices can be used in an application with dram...
Description	HEXFET Power MOSFET
File Size	159.41K / 8 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2101
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	HIGH AND LOW SIDE DRIVER
File Size	357.98K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2112
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	HIGH AND LOW SIDE DRIVER
File Size	379.67K / 14 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2113
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	HIGH AND LOW SIDE DRIVER
File Size	388.64K / 14 Page	View it Online	Download Datasheet

				IRF[International Rectifier]
Part No.	IR2117
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	SINGLE CHANNEL DRIVER
File Size	219.94K / 7 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2127
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	CURRENT SENSING SINGLE CHANNEL DRIVER
File Size	187.77K / 6 Page	View it Online	Download Datasheet

				International Rectifier
Part No.	IR2153
OCR Text	...aw Method of Die Bond Wire Bond leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thickness Material Thickness Package Remarks: Method Material Material Die Area Lead Plating Types Materials 80...
Description	SELF-OSCILLATING HALF-BRIDGE DRIVER
File Size	209.66K / 8 Page	View it Online	Download Datasheet

For leadframe Found Datasheets File :: 6443 Search Time::0.704ms
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