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11N60E U4648B 527B288J HC352 74LV2G74 TK71225M 4020B L3310ECA
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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA2951-EPU
OCR Text ...ld be observed during handling, assembly and test. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change wi...
Description 10 Gb/s Single Ended to Differential Amplifier TGA2951-EPU
10 Gb/s Single Ended to Differential Amplifier TGA2951-EPU

File Size 349.54K  /  10 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4022
OCR Text ...ld be observed during handling, assembly and test. 7 TriQuint Semiconductor Texas: Phone (972)994-8465 Fax (972)994-8504 Email: Info-mmw@tqs.com Web: www.triquint.com Advance Product Information February 10, 2006 TGA4022 Rec...
Description K-Band High Power Amplifier

File Size 103.67K  /  9 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4600-EPU
OCR Text ...ld be observed during handling, assembly and test. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ...
Description 60 GHz Low-Noise Amplifier
60GHz Low Noise Amplifier

File Size 123.48K  /  8 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4802-EPU
OCR Text ...ld be observed during handling, assembly and test. Note: Devices designated as EPU are typically early in their characterization process prior to finalizing all electrical and process specifications. Specifications are subject to change ...
Description 12.5GB/S IRZ Modulator Driver
12.5Gb/s Modulator Driver Amplifier

File Size 160.49K  /  10 Page

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    DF25216 DF25210 DF25212 DF25214 DF25208 DF252 DF25206

DYNEX[Dynex Semiconductor]
Part No. DF25216 DF25210 DF25212 DF25214 DF25208 DF252 DF25206
OCR Text ...6 AN4839 AN4853 AN5001 POWER assembly CAPABILITY The Power assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description Fast Recovery Diode

File Size 57.98K  /  8 Page

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    DF45216 DF45208 DF452 DF45206 DF45210 DF45212 DF45214

DYNEX[Dynex Semiconductor]
Part No. DF45216 DF45208 DF452 DF45206 DF45210 DF45212 DF45214
OCR Text ...3 AN5001 6/7 DF452 POWER assembly CAPABILITY The Power assembly group was set up to provide a support service for those customers requiring more than the basic semiconductor, and has developed a flexible range of heatsink / clamping...
Description Fast Recovery Diode

File Size 59.69K  /  7 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4805-EPU
OCR Text ... 0.1F Voffset Adjust Chip assembly and Bonding Diagram GaAs MMIC devices are susceptible to damage from Electrostatic Discharge. Proper precautions should be observed during handling, assembly and test. Note: Devices designated ...
Description 10GB/s Differential Transimpedance Amplifier
10 GB/s Differential Transimpedance Amplifier

File Size 206.34K  /  6 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4811
OCR Text ...une 30, 2005 TGA4811 Chip assembly Diagram Vg2 Vd 0.1uF 100pF 1800pF RF OUT RF IN 1800pF 0.1uF Vg1 3 (Three) 0.7 mil chisel bond wires at RF IN and RF OUT or 1 (one) 3 mil ribbon at RF IN and RF OUT. Vg2 ...
Description DC - 60 GHz Low Noise Amplifier

File Size 367.44K  /  9 Page

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    TRIQUINT[TriQuint Semiconductor]
Part No. TGA4815-EPU
OCR Text ...Bypass Capacitors Required (see assembly drawing) TABLE III THERMAL INFORMATION Parameter Test Conditions TCH (oC) RTJC (qC/W) TM (HRS) V+ = 3.3 V RJC Thermal I+ = 80 mA 80 36.9 5.7 E+7 Resistance (channel to backside of Pdiss = 0.264...
Description 10 GB/s Differential Transimpedance Amplifier
10Gb/s Differential TIA

File Size 104.13K  /  7 Page

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