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Amphenol Communications Solutions |
| Part No. |
68705-414HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 14 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0705410041 70541-0041
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| Description |
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 7 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
MOLEX Connector
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| File Size |
190.43K /
4 Page |
 View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
| Part No. |
10136647-054142LF
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| Description |
Minitek® Pwr 4.2, Single Row, Vertical Through Hole Header, LCP, 30u\\ Gold (Tin on Tails) plating, Natural Color, 5 Positions, Non GW Compatible, with out Posts, Tray packing.
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0705410042 70541-0042
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| Description |
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 8 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
MOLEX Connector
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| File Size |
190.43K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68705-411HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 11 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0705410074 70541-0074
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| Description |
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, with Beveled Plastic Peg, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, with Beveled Plastic Peg, 5 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn) PC Tail Plating
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| File Size |
190.25K /
4 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
68705-418HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 18 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68705-419HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 19 Positions, 2.54 mm Pitch, Vertical, 5.08 mm (0.2 in.) Mating, 2.41 mm (0.095 in.) Tail
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0705410079 70541-0079
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| Description |
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating, Tin (Sn
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| File Size |
190.52K /
4 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
0705410038 70541-0038
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| Description |
2.54mm (.100) Pitch SL?/a> Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
2.54mm (.100) Pitch SL Header, Single Row, Vertical, .120 Pocket, Shrouded, withBeveled Plastic Peg, 4 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tin (Sn) PC
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| File Size |
190.23K /
4 Page |
View
it Online |
Download Datasheet |
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