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Molex Electronics Ltd.
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| Part No. |
A-70567-0015 0015800341
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 34 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0015800145 15-80-0145 70567-0141
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| Description |
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
1,218.29K /
7 Page |
View
it Online |
Download Datasheet |
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Molex Electronics Ltd.
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| Part No. |
15-80-0101 70567-0003 A-70567-0003 0015800101
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.41K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-E1-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
70567-0010 A-70567-0010 0015800241
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, Tin (Sn) Plating
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| File Size |
1,218.42K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567FC-2N2-E1-A
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0105 0015800105 A-70567-0139
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.76渭m (30渭) Gold (Au) Selective Plat
Molex Electronics Ltd.
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| File Size |
1,218.43K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0107 0015800107 A-70567-0207
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.
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| File Size |
1,218.53K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567FC-2N2-A
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0109 0015800109 70567-0275 A-70567-0275
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 10 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.56K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567MC(S)-XXX-CAA-E1-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion), LSSOP, /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0125 0015800125 70567-0140
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.76渭m (30渭") Gold (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.47K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567MC-CAA-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
15-80-0129 0015800129 A-70567-0276
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, 0.38渭m (15渭) Gold, (Au) Selective Pla
Molex Electronics Ltd.
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| File Size |
1,218.57K /
7 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
UPD78F0567K8-3B4-E2-AX
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| Description |
Compact, Low-power 8-bit Microcontrollers for General Purpose Applications (Non Promotion)
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| Tech specs |
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Official Product Page
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