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    74AC138MTC 74AC138PC 74AC138SC 74AC138SJ 74ACT138 74AC138 74AC138.PDF 74ACT138SC 74ACT138SJ 74ACT138PC 74ACT138CW 74AC13

FAIRCHILD[Fairchild Semiconductor]
Fairchild Semiconductor, Corp.
Part No. 74AC138MTC 74AC138PC 74AC138SC 74AC138SJ 74ACT138 74AC138 74AC138.PDF 74ACT138SC 74ACT138SJ 74ACT138PC 74ACT138CW 74AC138CW
Description 1-of-8 Decoder/Demultiplexer
From old datasheet system
RECTIFIER FAST-RECOVERY SINGLE 3A 200V 100A-ifsm 0.9V-vf 25ns 10uA-ir SMC 3K/REEL-13 ACT SERIES, OTHER DECODER/DRIVER, INVERTED OUTPUT, PDIP16
File Size 99.81K  /  9 Page

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    TOSHIBA
Part No. TC58FVM6T2A TC58FVM6B2A
Description Flash - NOR
8Mx8 / 4Mx16 ; TSOP-I-48,TFBGA ;; Speed = 65ns/25ns Page ;; VCC = 2.7-3.6 ;; Read Icc Max (mA) = 55 ;; Standby Icc Max (uA) = 10 ;; Boot Block = Top ;;
File Size 716.25K  /  61 Page

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    5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 5962D0053601TXC 5962D0053602QXA 5962D0053602TUC 5962D0053602QXC 5962D005

Aeroflex Circuit Technology
Part No. 5962D0053601QUA 5962D0053601TXA 5962D0053602TXA 5962D0053601TXC 5962D0053602QXA 5962D0053602TUC 5962D0053602QXC 5962D0053603QUA 5962D0053601TUA 5962D0053601QXX 5962D0053601TUC 5962D0053601TUX 5962D0053602TUX 5962D0053602QUX 5962D0053602TXX 5962D0053602QXX 5962D0053602QUA 5962D0053601QXA 5962D0053601TXX 5962D0053602QUC 5962D0053602TXC 5962D0053601QXC 5962D0053602TUA 5962D0053601QUX 5962D0053601QUC 5962D0053603QUX 5962D0053603QXA 5962D0053603QXX 5962D0053603QXC 5962D0053603QUC UT9Q512-IWX UT9Q512-IWC UT9Q512-20ICC UT9Q512-20ICX UT9Q512-20IPC UT9Q512-20IWC UT9Q512-20UCC UT9Q512-20UCA UT9Q512-20UCX UT9Q512-20UWA UT9Q512-ICA UT9Q512-IPC UT9Q512-20ICA UT9Q512-20IWA UT9Q512-20IWX UT9Q512-20UPC UT9Q512-20UWC UT9Q512-20UWX UT9Q512-ICC UT9Q512-ICX UT9Q512-IWA UT9Q512-UCA 5962D0053603TXC 5962D0053604TXC 5962L0053601TXC 5962L0053602TXC 5962L0053603TXC 5962L0053604TXC 5962P0053601TXC 5962P0053602TXC 5962P0053603TXC 5962P0053604TXC 5962L0053601QUA 5962L0053601QUC 5962L0053601QUX 5962L0053601QXA 5962L0053601QXC 5962L0053601QXX 5962L0053601TUA 5962L0053601TUC 5962L0053601TUX 5962L0053601TXX 5962L0053602QUA 5962L0053602QUC 5962L0053602QUX 5962L0053602QXA 5962L0053602QXC 5962L0053602TUA 5962L0053602
Description 512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish factory option.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish factory option.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish gold. Prototype flow.
512K x 8 SRAM MCM. 20ns access time, 5.0V operation. Lead finish hot solder dipped.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish hot solder dipped.
512K x 8 SRAM MCM. 25ns access time, 5.0V operation. Lead finish gold. Prototype flow.
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 5E4(50krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 25ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class T. Lead finish factory option. Total dose 1E4(10krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish hot solder dipped. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish gold. Total dose 3E4(30krad(Si)).
512K x 8 SRAM MCM: SDM. 20ns access time, 5.0V operation. QML class Q. Lead finish factory option. Total dose 3E4(30krad(Si)).
File Size 128.60K  /  15 Page

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    ES2X-13-F ES2XA-13-F ES2B-13-F ES2AA

Diodes Incorporated
Diodes, Inc.
Part No. ES2X-13-F ES2XA-13-F ES2B-13-F ES2AA
Description 2.0A SURFACE MOUNT SUPER-FAST RECTIFIER
RECTIFIER FAST-RECOVERY SINGLE 2A 100V 50A-ifsm 0.92V-vf 25ns 5uA-ir SMB 3K/REEL-13 2 A, 100 V, SILICON, RECTIFIER DIODE
Glass Passivated Die Construction
File Size 110.44K  /  4 Page

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    5962H9475407QLC 5962F9475401QLA 5962F9475401QLC 5962F9475401QLX 5962F9475401QXA 5962F9475401QXC 5962F9475401QYA 5962F947

Aeroflex Circuit Technology
Part No. 5962H9475407QLC 5962F9475401QLA 5962F9475401QLC 5962F9475401QLX 5962F9475401QXA 5962F9475401QXC 5962F9475401QYA 5962F9475401QXX 5962F9475401QYC 5962F9475401QYX 5962F9475401VLA 5962F9475401VLC 5962F9475401VLX 5962F9475401VXA 5962F9475401VXC 5962F9475403QYX 5962F9475402QYX 5962F9475404QYX 5962F9475406QYX 5962F9475405QYX 5962F9475405VLA 5962F9475405VLC 5962F9475405VLX 5962F9475405VXA 5962F9475405VXC 5962F9475405VXX 5962G9475401QLC 5962G9475401QLX 5962G9475401QLA 5962G9475401QXA 5962G9475401QXC 5962G9475401QXX 5962F9475402QLC 5962F9475403QLC 5962F9475406QLC 5962F9475408QLC 5962G9475402QLC 5962G9475403QLC 5962G9475404QLC 5962G9475406QLC 5962G9475407QLC 5962H9475403QLC 5962H9475404QLC 5962H9475405QLC 5962H9475406QLC 5962R9475402QLC 5962R9475405QLC 5962F9475405QLC 5962H9475401QLC 5962R9475401QLC 5962F9475407QLC 5962R9475404QLC 5962F9475404QLC 5962G9475405QLC 5962H9475408QLC 5962F9475401VYC 5962F9475402QYA 5962F9475402QLX 5962F9475402QXX 5962F9475402QXA 5962R9475401VYX 5962R9475401QYX 5962R9475401QYA 5962R9475401VLC 5962R9475401VYC 5962R9475401QXX 5962R9475401QYC 5962R9475401QLA 5962R9475401VXX 5962R9475401QXA 5962R9475401VLA 5962R9475401VLX 5962F9475406VLX 5962F9475406VLC 5962R9475406VLX
Description Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class G. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 25ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 25ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 25ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, TTL I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class Q. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 3E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 20ns propagation delay, TTL I/O. Class Q. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish gold.
Radiation Hardened PAL: SMD. Total dose 5E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E6 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish solder.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 15.5ns propagation delay, CMOS I/O. Class V. Lead finish optional.
Radiation Hardened PAL: SMD. Total dose 1E5 rads(Si). 20ns propagation delay, TTL I/O. Class V. Lead finish gold.
File Size 199.46K  /  19 Page

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    Cypress Semiconductor, Corp.
Part No. CY14B104M-ZSP25XI
Description Non-Volatile Static RAM (nvSRAM); Organization: 256x16; Density: 4MB; Speed: 25ns; Supply Voltage: 3V; Temperature Range: -40&deg; to 85&deg;C; Package: 54-TSOP-II ; Features: Real-Time Clock 256K X 16 NON-VOLATILE SRAM, 25 ns, PDSO54
File Size 811.09K  /  33 Page

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    Fairchild Semiconductor, Corp.
FAIRCHILD[Fairchild Semiconductor]
Part No. 74F38SJ 74F38SC 74F38PC 74F38 74F38S 54F38LMQB
Description RECTIFIER FAST-RECOVERY SINGLE 3A 200V 100A-ifsm 0.9V-vf 25ns 10uA-ir SMB 3K/REEL-13 F/FAST SERIES, QUAD 2-INPUT NAND GATE, PDIP14
Quad Two-Input NAND Buffer (Open Collector)
File Size 57.93K  /  5 Page

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    Cypress
Part No. CY7C344B-15HI CY7C344B-25HI CY7C344B-15WC CY7C344B-15WI
Description 32-macrocell EPLD, 15ns
32-macrocell EPLD, 25ns
File Size 214.61K  /  12 Page

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    ADVANCED MICRO DEVICES INC
Part No. AM29LV800BT-80DTC2 AM29LV800BT-80DGI2 AM29LV800BT-80DPI2 AM29LV800BT-80DWC2 AM29LV800BT-80DWI2 AM29LV800BT-80DGC2 AM29LV800BT-80DTI2 AM29LV800BT-80DPC2 AM29LV800BB-80DGI2 AM29LV800BB-80DPI2 AM29LV800BB-80DTI2 AM29LV800BB-80DWC2 AM29LV800BB-80DWI2 AM29LV800BB-80DPC2 AM29LV800BB-80DGC2 AM29LV800BB-80DTC2 AM29LV800BB-120DTC2 AM29LV800BT-90DPI2 AM29LV800BT-90DTI2 AM29LV800BT-90DWI2 AM29LV800BT-120DTI2 AM29LV800BB-120DTI2 AM29LV800BT-120DGI2 AM29LV800BT-120DTC2 AM29LV800BB-90DTI2 AM29LV800BB-90DGC2 AM29LV800BB-120DGC2 AM29LV800BT-120DPC2 AM29LV800BT-90DPC2 AM29LV800BT-120DWI2 AM29LV800BB-120DPC2 AM29LV800BB-90DPC2 AM29LV800BB-90DWI2
Description 25ns,OTP CERDIP,883C; LEV B FULLY CMPLNT(EPLD)
20NS, OTP, PLCC, COM TEMP(EPLD)
20NS, SOIC, IND TEMP(EPLD)
25ns, SOIC, COM TEMP(EPLD)
20NS,OTP LCC,883C; LEVEL B FULLY CMPLNT(EPLD)
10MHZ, 8 DIP, COM TEMP(FPGA)
10MHZ, 20 PLCC, IND TEMP(FPGA)
10MHZ, 32 TQFP, COM TEMP(FPGA)
10MHZ, 44 PLCC, COM TEMP(FPGA)
30MHZ, 3.3V, 20 PLCC, COM TEMP(FPGA)
8 TSSOP,PB/HALO FREE,IND,1.8V(SERIAL EE)
DIE SALE, 1.8V, 11 MIL(SERIAL EE)
8 PDIP,PB/HALO FREE,IND TEMP,1.8V(SERIAL EE)
65K CONFIG MEM, 20 PLCC, IND TEMP(FPGA)
10MHZ, 20 SOIC, IND TEMP(FPGA)
128K CONFIG MEM, 20 PLCC, COM(FPGA)
EEPROM EEPROM
10MHZ, 8 NSOIC, COM TEMP(FPGA) EEPROM
512K X 16 FLASH 3V PROM, 120 ns, UUC44
10MHZ, 8 LAP, 5K MOQ(FPGA)
10MHZ, 8 N-SOIC, COM TEMP(FPGA)
10MHZ, 20 PLCC, COM TEMP(FPGA)
512K X 16 FLASH 3V PROM, 80 ns, UUC44
File Size 127.66K  /  11 Page

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    Cypress
Part No. CY7C341B-35HI CY7C341B-35HC CY7C341B-25HI
Description 192-macrocell EPLD, 35ns
192-macrocell EPLD, 25ns
File Size 205.72K  /  11 Page

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