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  01580 Datasheet PDF File

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    0015800643

Molex Electronics Ltd.
Part No. 0015800643
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits

File Size 1,218.29K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015803AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    0015800641

Molex Electronics Ltd.
Part No. 0015800641
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 64 Circuits, Tin (Sn) Plating

File Size 1,218.24K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015804AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

    0015800449 15-80-0449

Molex Electronics Ltd.
Part No. 0015800449 15-80-0449
Description 2.54mm (.100") Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature

File Size 1,218.39K  /  7 Page

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    0015800203 15-80-0203

Molex Electronics Ltd.
Part No. 0015800203 15-80-0203
Description 2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plat
2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 20 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating

File Size 1,218.27K  /  7 Page

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    0015800245

Molex Electronics Ltd.
Part No. 0015800245
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 24 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    0015800563

Molex Electronics Ltd.
Part No. 0015800563
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits

File Size 1,218.25K  /  7 Page

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    0015800409

Molex Electronics Ltd.
Part No. 0015800409
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.39K  /  7 Page

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    0015800405

Molex Electronics Ltd.
Part No. 0015800405
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 40 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.30K  /  7 Page

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    0015800565

Molex Electronics Ltd.
Part No. 0015800565
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 56 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating

File Size 1,218.29K  /  7 Page

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    15-80-0363 0015800363

Molex Electronics Ltd.
Part No. 15-80-0363 0015800363
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 36 Circuits

File Size 1,218.30K  /  7 Page

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Part: 0154007.DR
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