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  mpak-4 Datasheet PDF File

For mpak-4 Found Datasheets File :: 617    Search Time::4.796ms    
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    HSM124 HSM124S

HITACHI[Hitachi Semiconductor]
Part No. HSM124 HSM124S
OCR Text MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information Type No. HSM124S Laser Mark A1 ...4 100 125 -55 to +125 Unit V V mA A mA C C Electrical Characteristics* (Ta = 25C) Item Forwar...
Description Silicon Epitaxial Planar Diode for Switching

File Size 25.73K  /  6 Page

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    HSM221C

Hitachi,Ltd.
Hitachi Semiconductor
Part No. HSM221C
OCR Text ...oltage. * Fast recovery time. * MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information ...4 100 125 -55 to +125 Unit V V mA A mA C C Electrical Characteristics (Ta = 25C) Item Forward vo...
Description Silicon Epitaxial Planar Diode for High Speed Switching 硅外延平面二极管高速开

File Size 16.32K  /  5 Page

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    MPXM2202 MPXM2202A MPXM2202AS MPXM2202AST1 MPXM2202AT1 MPXM2202D MPXM2202DT1 MPXM2202GS MPXM2202GST1

Motorola, Inc.
飞思卡尔半导体(中国)有限公司
MOTOROLA[Motorola, Inc]
Part No. MPXM2202 MPXM2202A MPXM2202AS MPXM2202AST1 MPXM2202AT1 MPXM2202D MPXM2202DT1 MPXM2202GS MPXM2202GST1
OCR Text ...escale Semiconductor, Inc... MPAK PACKAGE SCALE 1:1 CASE 1320 SCALE 1:1 CASE 1320A X-ducer SENSING ELEMENT 2 4 Vout+ PIN NUMBER 1 Gnd +Vout 3 4 VS -Vout 2 Vout- Figure 1. Temperature Compensated Pressure Sensor S...
Description 200kPa On-Chip Temperature Compensated & Calibrated Silicon Pressure Sensors(200kPa片内温度补偿和校准硅压力传感
200 KPA ON CHIP TEMPERATURE COMPENSATED & CALIBRATED SILICON PRESSURE SENSORS

File Size 243.98K  /  8 Page

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    HRW0702A

HITACHI[Hitachi Semiconductor]
Part No. HRW0702A
OCR Text ...r high effifiency rectifying. * MPAK Package is suitable for high density surface mounting and high speed assembly. Ordering Information ...4 5 125 -55 to +125 Unit V mA A A C C I F* 1 I FM I FSM *2 Tj Tstg Notes 1. See from Fig.4 ...
Description Silicon Schottky Barrier Diode for Rectifying

File Size 31.74K  /  6 Page

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    HRW0703A

HITACHI[Hitachi Semiconductor]
Part No. HRW0703A
OCR Text ...r high effifiency rectifying. * MPAK package is suitable for high density surface mounting and high speed assembly. Ordering Information ...4 to Fig.7, with polyimide board 2. 50Hz sine wave 1 pulse Electrical Characteristics (Ta = 25C) ...
Description Silicon Schottky Barrier Diode for Rectifying

File Size 32.98K  /  6 Page

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    Renesas Electronics Corporation.
Part No. HA1631S01LP HA1631S04 HA1631S02CM
OCR Text ...on ? available in cmpak-5 and mpak-5 package using pb free lead frame outline ha1631s01cm ha1631s02cm ha1631s03cm ha1631s04cm ha1631s0...4 +? equivalent circuit v dd in? output * not available in open drain version (ha1631s03/04) * ...
Description Single CMOS Comparator (Push Pull/Open Drain Output)

File Size 276.84K  /  23 Page

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    Hitachi,Ltd.
Part No. HSM223C
OCR Text ...oltage. fast recovery time. mpak package is suitable for high density surface mounting and high speed assembly. ordering information typ...4 a average forward current i o 100 ma junction temperature tj 125 c storage temperature tstg C55 to...
Description Silicon Epitaxial Planar Diode for High Speed Switching(用于高速开关的平面外延PIN二极 硅平面二极管外延高开关(用于高速开关的平面外延的PIN二极管速度

File Size 24.74K  /  4 Page

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For mpak-4 Found Datasheets File :: 617    Search Time::4.796ms    
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