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74AUP1 A3046 KTC813U LT143 MAX31 1SMA110 1A66B MCR10
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    RPI-124

Rohm
Part No. RPI-124
Description Sensors > Photointerrupters > Linear Phototransistor output
PHOTO INTERRUPTER, DOUBLE-layer MOLD TYPE
Photo interrupter/ double-layer mold type
File Size 73.34K  /  3 Page

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    Lineage Power, Corp.
Part No. HW3000M HW2000
Description Home Phoneline Networking Physical layer(主电话线网络物理 家庭电话线网络物理层（主电话线网络物理层
Home Phoneline Networking Physical layer(涓荤?璇?嚎缃???╃?灞?
File Size 93.12K  /  6 Page

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    PA-5R0V474 PB-5R0H474-R PA-5R0V224 PA-5R0V224-R

Cooper Bussmann, Inc.
HIROSE ELECTRIC Co., Ltd.
Part No. PA-5R0V474 PB-5R0H474-R PA-5R0V224 PA-5R0V224-R
Description CAPACITOR .47F 5V RAD AEROGEL CAPACITOR, ELECTRIC DOUBLE layer, 5 V, 470000 uF, THROUGH HOLE MOUNT
CAPACITOR, ELECTRIC DOUBLE layer, 5 V, 470000 uF, THROUGH HOLE MOUNT RADIAL LEADED
CAPACITOR, ELECTRIC DOUBLE layer, 5 V, 220000 uF, THROUGH HOLE MOUNT RADIAL LEADED
File Size 64.41K  /  2 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CI201210-6N8J CI201210-5N6D CI201210-4N7D CI201210-8N2J CI201210-2N2D CI201210-2N7D CI201210-R33J CI201210-R39J CI201210-47NJ CI201210-R47J CI201210-33NJ CI201210-1N8D CI201210-1N0D CI201210-R27J CI201210-R12J CI201210-68NJ CI201210-1N5D CI201210-R18J CI201210-18NJ CI201210-10NJ
Description Multi-layer Chip Inductors 1 ELEMENT, 0.12 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0047 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.39 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 433.40K  /  2 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CI160808-1N0D CI160808-1N2D CI160808-1N5D CI160808-2N2D CI160808-2N7D CI160808-6N8J CI160808-4N7D CI160808-8N2J CI160808-R22J CI160808-R27J CI160808-1N8D CI160808-56NJ CI160808-68NJ CI160808-18NJ CI160808-R15J CI160808-27NJ CI160808-R18J
Description Multi-layer Chip Inductors 1 ELEMENT, 0.018 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.15 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.18 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 243.82K  /  2 Page

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    Micronas Semiconductor Holding AG
Part No. MAS3519F MAS3529F MAS3539F MAS3549F MAS3559F MAS35X9F MAS3509F
Description MAS 35x9F MPEG layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层，AAC音频解码器，G.729的附A编解码器
(MAS35x9F) MPEG layer 2/3 AAC Audio Decoder
MAS 35x9F MPEG layer 2/3, AAC Audio Decoder, G.729 Annex A Codec 新加坡金融管理局35x9F的MPEG 2 / 3层，AAC音频解码器，G.729的附件A编解码器
File Size 1,175.23K  /  92 Page

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    Philips
Part No. PXAC37KFA/00 PXAC37KFBD/00
Description XA-C3; XA 16-bit microcontroller family 32K/1024 OTP/ROM CAN transport layer controller 1 UART, 1 SPI Port, CAN 2.0B, 32 CAN ID Filters, ...
XA 16-bit microcontroller family 32K/1024 OTP/ROM CAN transport layer controller 1 UART, 1 SPI Port, CAN 2.0B, 32 CAN ID Filters, transport layer co-processor
File Size 357.24K  /  68 Page

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    Micrel Semiconductor, Inc.
MICREL INC
Part No. KSZ8041MNLU KSZ8041MNLUTR TLA-6T718 H1102 KSZ8041NLITR KSZ8041RNL KSZ8041RNLI KSZ8041RNLU HB726 KSZ8041NLAM
Description DATACOM, ETHERNET TRANSCEIVER, QCC32 5 X 5 MM, LEAD FREE, MLF-32
10Base-T/100Base-TX Physical layer Transceiver
   10Base-T/100Base-TX Physical layer Transceiver
File Size 688.98K  /  54 Page

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    RPI-122 A5800739 RPI122

Rohm CO.,LTD.
Part No. RPI-122 A5800739 RPI122
Description Photointerrupter/ double-layer mold type
PHOTOINTERRUPTER, DOUBLE-layer MOLD TYPE
From old datasheet system
File Size 80.24K  /  3 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CI100505-5N6D CI100505-R10J CI100505-8N2J CI100505-12NJ CI100505-15NJ CI100505-18NJ CI100505-22NJ CI100505-27NJ CI100505-33NJ CI100505-39NJ CI100505-47NJ CI100505-56NJ CI100505-1N0D CI100505-4N7D CI100505-1N5D CI100505-2N2D CI100505-68NJ CI100505-82NJ CI100505-2N7D
Description Multi-layer Chip Inductors 1 ELEMENT, 0.0015 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0022 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.068 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.082 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
Multi-layer Chip Inductors 1 ELEMENT, 0.0027 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
File Size 430.53K  /  2 Page

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