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Molex Electronics Ltd.
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| Part No. |
87636-2102
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| OCR Text |
....5v left voltage key, 3.23mm (.127") tail length, 0.38m (15") gold (au) plating, 184 circuits, leadfree documents: 3d model product specification ps-87736-003 (pdf) drawing (pdf) rohs certificate of... |
| Description |
1.27mm (.050) Pitch DDR DIMM Socket, Vertical, Black Latch, Single Key, with Beveled Metal Pins, 2.5V Left Voltage Key, 3.23mm (.127) Tail Length
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| File Size |
251.57K /
6 Page |
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it Online |
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Zarlink
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| Part No. |
MT90863
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| OCR Text |
...ntified by metallized markings. 23mm x 23mm Ball Pitch 1.5mm
Figure 3 - BGA Pin Connections
Zarlink Semiconductor Inc.
3
MT90863
Pin Description
128 MQFP Pin# 144 BGA Pin# Name VDD +3.3 Volt Power Supply Description
Data Sh... |
| Description |
3V Rate Conversion Digital Switch
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| File Size |
508.93K /
43 Page |
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it Online |
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Applied Micro Circuits Corp.
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| Part No. |
S2065
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| OCR Text |
...7 w power dissipation ? compact 23mm x 23mm 208 tbga package ? redundant high speed transmit and receive serial interfaces applications high-speed data communications ? ethernet backbones ? workstation ? frame buffer ? switched networks ... |
| Description |
Quad Serial Backplane Device with Dual I/O(带双传送接收串行I/O的四收发
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| File Size |
389.30K /
37 Page |
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it Online |
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Applied Micro Circuits Corp.
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| Part No. |
S2064
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| OCR Text |
...3 w power dissipation ? compact 23mm x 23mm 208 tbga package applications ? ethernet backbones ? workstation ? frame buffer ? switched networks ? data broadcast environments ? proprietary extended backplanes general description the s2064 fa... |
| Description |
Quad Serial Backplane Device(用于以太网，光纤通道高速串行数据传送的四收发器)
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| File Size |
347.69K /
33 Page |
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it Online |
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Applied Micro Circuits Corp.
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| Part No. |
S2004
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| OCR Text |
...5 w power dissipation ? compact 23mm x 23mm 208 tbga package applications ? ethernet backbones ? workstation ? frame buffer ? switched networks ? data broadcast environments ? proprietary extended backplanes general description the s2004 fa... |
| Description |
Quad Serial Backplane Device(用于高速串行数据传送的四串行收发器)
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| File Size |
386.12K /
38 Page |
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it Online |
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pmc
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| Part No. |
2001515
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| OCR Text |
...
* 324-fine pitch PBGA package (23mm x 23mm). * Supports industrial temperature range (-40 C to 85 C) operation.
APPLICATIONS
* Metro Optical SONET/SDH Add/Drop and Terminal Multiplexers. * Multi-Service Switches. * Unchannelized DS3 Fr... |
| Description |
From old datasheet system
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| File Size |
19.93K /
2 Page |
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it Online |
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pmc
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| Part No. |
2001654
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| OCR Text |
...s. It is available in a 288-pin 23mm x 23mm BGA package and implemented using low power 1.8/3.3V CMOS technology with 3.3V tolerant inputs. The OCTLIU is a versatile and feature rich device that provides enhanced diagnostics, standards comp... |
| Description |
From old datasheet system
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| File Size |
523.65K /
22 Page |
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it Online |
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Integrated Device Technology, Inc.
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| Part No. |
80KSBR200
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| OCR Text |
...4-pin plastic ball grid array ? 23mm x 23mm, 1.0mm ball pitch advanced datasheet 80ksbr200 srio serial buffer flow-control device tck tms tdi tdo j t a g i n p u t d e s e r i a l i z e r o u t p u t s e r i a l i z e r 1 x/4x sri... |
| Description |
sRIO SERIAL BUFFER FLOW-CONTROL DEVICE
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| File Size |
1,348.80K /
172 Page |
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it Online |
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Price and Availability
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