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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI212P082931-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/lte/ism900 lifecycle stage mass production standard packaging quantity (minimum) taping embossed... |
| Description |
Multilayer Ceramic Devices (Diplexers)
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| File Size |
244.32K /
2 Page |
 View
it Online |
Download Datasheet
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RFMD[RF Micro Devices]
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| Part No. |
RF3158PCBA-41X RF3158
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| OCR Text |
RF3158
QUAD-BAND GSM/EDGE/GSM850/EGSM900 /DCS/PCS POWER AMPLIFIER MODULE
RoHS Compliant & Pb-Free Product Package Style: Module (6mmx6mm)
HB RFIN 1
18 HB RFOUT
Features
Linear EDGE and GSM Operation PowerStar(R) GSM/GPRS Power C... |
| Description |
QUAD-BAND GSM/EDGE/GSM850/EGSM900 /DCS/PCS POWER AMPLIFIER MODULE
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| File Size |
606.84K /
26 Page |
View
it Online |
Download Datasheet |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168W1697B1-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/lte/ism900 lifecycle stage mass production standard packaging quantity (minimum) taping papered ... |
| Description |
Multilayer Ceramic Devices (2 Branch Coupler)
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| File Size |
261.70K /
2 Page |
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it Online |
Download Datasheet |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168P157525-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/ism900/bluetooth/w-l an/gps lifecycle stage mass production standard packaging quantity (minimum... |
| Description |
Multilayer Ceramic Devices (Diplexers)
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| File Size |
242.36K /
2 Page |
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it Online |
Download Datasheet |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168L2200G9-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/lte lifecycle stage mass production standard packaging quantity (minimum) taping papered 5000 pr... |
| Description |
Multilayer Ceramic Devices (Low Pass Type)
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| File Size |
241.43K /
2 Page |
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it Online |
Download Datasheet |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168L0628M4-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/lte lifecycle stage mass production standard packaging quantity (minimum) taping papered 4000 pr... |
| Description |
Multilayer Ceramic Devices (Low Pass Type)
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| File Size |
244.34K /
2 Page |
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it Online |
Download Datasheet |
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Taiyo Yuden (U.S.A.), I...
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| Part No. |
FI168K1687AA-T
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| OCR Text |
...ww.ty-top.com t h e d a t a i s r e f e r e n c e o n l y . e l e c t r i c a l c h a r a c t e r i s t i c s v a r y d e p e n d i n g o n ...gsm/lte/ism900/bluetooth/ w-lan/wimax/gps lifecycle stage mass production standard packaging quantit... |
| Description |
Multilayer Ceramic Devices (Coupler)
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| File Size |
242.87K /
2 Page |
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it Online |
Download Datasheet |
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RFMD[RF Micro Devices]
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| Part No. |
RF3159PCBA-41X RF3159
|
| OCR Text |
RF3159
QUAD-BAND GSM/EDGE/GSM850/EGSM900 /DCS/PCS/POWER AMPLIFIER MODULE
RoHS Compliant & Pb-Free Product Package Style: Module (6mmx6mm)
HB RFIN 1
18 HB RFOUT
BAND SEL 2
Features
High Gain for use in Systems with Low RF Driv... |
| Description |
QUAD-BAND GSM/EDGE/GSM850/EGSM900 /DCS/PCS/POWER AMPLIFIER MODULE
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| File Size |
564.08K /
26 Page |
View
it Online |
Download Datasheet |
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Price and Availability
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