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  B60-2C30-JEE Datasheet PDF File

For B60-2C30-JEE Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

    F12C40 F12C60 F12C30 F12C50

Mospec Semiconductor, Corp.
MOSPEC SEMICONDUCTOR CORP.
MOSPEC[Mospec Semiconductor]
Part No. F12C40 F12C60 F12C30 F12C50
Description POWER RECTIFIERS(12A,300-600V) 大功率整流器(第12A ,300 - 600V的)

File Size 140.88K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDC62POL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Pin, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    U12C30 U12C40 U12C50 U12C60

MOSPEC SEMICONDUCTOR CORP.
MOSPEC[Mospec Semiconductor]
Part No. U12C30 U12C40 U12C50 U12C60
Description POWER RECTIFIERS(12A/300-600V)
POWER RECTIFIERS(12A,300-600V)

File Size 138.85K  /  2 Page

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Amphenol Communications Solutions

Part No. 10155552-C303KLF
Description Minitek MicroSpaceXS,1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 3 Position., STG, Side Latch, Gold; C Coding
Tech specs    

Official Product Page

    DMC42C3008

Daewoo Semiconductor
Part No. DMC42C3008
Description 4Bit Single Chip Microcontroller

File Size 113.75K  /  20 Page

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Amphenol Communications Solutions

Part No. L717TSA15POL2C309
Description Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 15 Pin, Bright Tin Shell+Grounding Dimples, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
Tech specs    

Official Product Page

    B60K

Micronetics, Inc.
Part No. B60K
Description Double Balanced Mixers 6.0 to 10.0 GHz

File Size 328.88K  /  2 Page

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Amphenol Communications Solutions

Part No. L717HDAH26POL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 26 Pin, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    B60V

Micronetics, Inc.
Part No. B60V
Description Double Balanced Mixers 6.0 to 10.0 GHz

File Size 328.88K  /  2 Page

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Amphenol Communications Solutions

Part No. 10155502-C308KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 8 Position, STG, Top Latch, Gold; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    B601

NEC
Part No. B601
Description Search --To 2SB601

File Size 159.11K  /  6 Page

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Amphenol Communications Solutions

Part No. L77TSC37SOL2C309
Description Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm(0.237in), 37 Socket, Bright Tin Shell, 0.76m(30 in) Gold, 3.05mm (0.120in) Clear Hole
Tech specs    

Official Product Page

    B60A

Micronetics, Inc.
Part No. B60A
Description Double Balanced Mixers 6.0 to 10.0 GHz

File Size 328.88K  /  2 Page

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Amphenol Communications Solutions

Part No. L77TSCH37SOL2C309
Description Dsub, Stamped Signal 3A, Straight PCB Thru Hole Low Profile, Height=6.02mm (.237in), 37 Socket, Bright Tin Shell, 0.76um (30u\\) Gold, 4-40 Threaded Rear Insert
Tech specs    

Official Product Page

    Lumileds Lighting Compa...
Part No. PB60
Description    Bright domed solution

File Size 1,357.52K  /  2 Page

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Amphenol Communications Solutions

Part No. 10155502-C309KLF
Description Minitek MicroSpaceXS™ 1.27mm Crimp-to-Wire Connector Platform, wire-to-board, Header Vertical, 9 Position, STG, Top Latch, Gold; C Coding<br><br>(For product qualification latest status, please submit <a href=\\javascript:;\\ class=\\button product-enquiry\\ style=\\background: none;color: red;\\><span>Product Enquiry</span></a>)
Tech specs    

Official Product Page

    American Microsemiconductor
Part No. VB60
Description High Voltage Diffused Silicon Rectifiers

File Size 132.42K  /  1 Page

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Amphenol Communications Solutions

Part No. L77HDC62SOL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, Back Insulator Plus Back Shell Height 6.0mm, 62 Socket, 0.76m (30 in) Gold, 3.05mm (0.120in) Clear Hole, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

    B60H

Micronetics, Inc.
Part No. B60H
Description Double Balanced Mixers 6.0 to 10.0 GHz

File Size 328.88K  /  2 Page

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Amphenol Communications Solutions

Part No. L77HDBH44SOL2C309
Description Dsub, Stamped Signal 3A, High Density, Straight PCB Thru Hole, 44 Socket, 0.76m (30 in) Gold, 4-40 Rear Nut Height 5.9mm, Without Bracket, Without Boardlock
Tech specs    

Official Product Page

For B60-2C30-JEE Found Datasheets File :: 150+       Page :: | 1 | <2> | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | 15 |   

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