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  LI-IMX390-FPDLINKIII-120H Datasheet PDF File

For LI-IMX390-FPDLINKIII-120H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

    STGW30NC120HD STGW30NC120HD_07 GW30NC120HD STGW30NC120HD07

STMICROELECTRONICS[STMicroelectronics]
Part No. STGW30NC120HD STGW30NC120HD_07 GW30NC120HD STGW30NC120HD07
Description N-channel 1200V - 30A - TO-247 Very fast PowerMESH TM IGBT

File Size 273.79K  /  13 Page

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Amphenol Communications Solutions

Part No. 68657-120HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54mm Pitch, Vertical, 3.05mm (0.12in) Mating, 9.35mm (0.368in) Tail.
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    APTM120H140FT1G

http://
Microsemi Corporation
Part No. APTM120H140FT1G
Description Full - Bridge MOSFET Power Module

File Size 137.94K  /  5 Page

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Amphenol Communications Solutions

Part No. 94063-120HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Microsemi, Corp.
White Electronic Designs, Corp.
Part No. WE128K32-XH1X WE128K32-XG2TX WE128K32NP-200H1Q WE128K32NP-120H1Q WE128K32NP-150H1Q WE128K32NP-140H1Q WE128K32NP-140H1QA WE128K32NP-200H1QA WE128K32NP-250H1Q WE128K32NP-150H1QA WE128K32NP-120H1QA
Description EEPROM MCP
128K X 32 EEPROM 5V MODULE, 200 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 120 ns, CPGA66 1.075 x 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 150 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 140 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66
128K X 32 EEPROM 5V MODULE, 250 ns, CPGA66 1.075 X 1.075 INCH, HERMETIC SEALED, CERAMIC, HIP-66

File Size 403.23K  /  14 Page

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Amphenol Communications Solutions

Part No. 68498-120HLF
Description BergStik®, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54 mm Pitch, Right Angle, 5.84 mm (0.23 in.) Mating, 5.59 mm (0.22 in.) Tail
Tech specs    

Official Product Page

    MAZZ000H MAZZ062H MAZZ068H MAZZ082H MAZZ100H MAZZ120H

Panasonic Semiconductor
Part No. MAZZ000H MAZZ062H MAZZ068H MAZZ082H MAZZ100H MAZZ120H
Description Small-signal device - Diodes - Zener Diodes
Silicon planar type

File Size 51.56K  /  3 Page

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Amphenol Communications Solutions

Part No. 68797-120HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54mm Pitch, Vertical, 2.54mm (0.1in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    PANASONIC[Panasonic Semiconductor]
Part No. MAZW120H MAZW000H MAZW062H MAZW068H MAZW082H MAZW100H
Description Silicon planar type For surge absorption circuit

File Size 72.09K  /  3 Page

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Amphenol Communications Solutions

Part No. 78548-120HLF
Description 78548-120HLF-B/S II
Tech specs    

Official Product Page

    MAZL000H MAZL062H MAZL068H MAZL082H MAZL120H MAZL100H

Panasonic Corporation
PANASONIC[Panasonic Semiconductor]
Part No. MAZL000H MAZL062H MAZL068H MAZL082H MAZL120H MAZL100H
Description Silicon planar type
Small-signal device - Diodes - Zener Diodes

File Size 52.43K  /  3 Page

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Amphenol Communications Solutions

Part No. 94654-120HLF
Description BERGSTIK II DR STRAIGHT-RET
Tech specs    

Official Product Page

    MRF8S18120HR3 MRF8S18120HSR3

Freescale Semiconductor, Inc
Part No. MRF8S18120HR3 MRF8S18120HSR3
Description RF Power Field Effect Transistors N-Channel Enhancement-Mode Lateral MOSFETs

File Size 280.43K  /  14 Page

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Amphenol Communications Solutions

Part No. 68422-120HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Header, Through Hole, Single Row, 20 Positions, 2.54mm Pitch, Vertical, 8.08mm (0.318in) Mating, 5.41mm (0.213in) Tail.
Tech specs    

Official Product Page

    MRF6S19120H MRF6S19120HR3 MRF6S19120HSR3

Freescale Semiconductor, Inc
Part No. MRF6S19120H MRF6S19120HR3 MRF6S19120HSR3
Description RF Power Field Effect Transistors

File Size 439.62K  /  12 Page

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Amphenol Communications Solutions

Part No. 69168-120HLF
Description PV® Wire-to-Board Connector System, 2 Wall Shrouded Header - Through Hole - Double row - 20 Positions 2.54mm - Vertical.
Tech specs    

Official Product Page

    MRF8S23120H MRF8S23120HR3 MRF8S23120HSR3

Freescale Semiconductor, Inc
Part No. MRF8S23120H MRF8S23120HR3 MRF8S23120HSR3
Description RF Power Field Effect Transistors N--Channel Enhancement--Mode Lateral MOSFETs

File Size 442.18K  /  14 Page

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Amphenol Communications Solutions

Part No. 93944-120HLF
Description BergStik® 2.54mm, Board To Board Connector, Unshrouded Vertical Header, Through Hole, Single Row, 20 Positions, 2.54mm (0.100in) Pitch.
Tech specs    

Official Product Page

    Motorola
Part No. MRF8S26120HR3 MRF8S26120HSR3
Description RF Power Field Effect Transistor

File Size 533.04K  /  15 Page

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Amphenol Communications Solutions

Part No. 68739-120HLF
Description BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 20 Positions, 2.54 mm (0.100in)Pitch.
Tech specs    

Official Product Page

For LI-IMX390-FPDLINKIII-120H Found Datasheets File :: 150+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | 13 | 14 | <15> |   

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