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74AUP1 A3046 KTC813U LT143 MAX31 1SMA110 1A66B MCR10
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For layer Found Datasheets File :: 23033    Search Time::1.796ms    
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    ICS9179B-01 ICS9179BF-01

ICST[Integrated Circuit Systems]
Part No. ICS9179B-01 ICS9179BF-01
OCR Text ...) Use a ground plane on the top layer of the PCB in all areas not used by traces. 2) Make all power traces and vias as wide as possible to lower inductance. Notes: 1 All clock outputs should have series terminating resistor. Not shown in...
Description Low Skew Buffers

File Size 510.52K  /  9 Page

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    IR2101

IRF[International Rectifier]
Part No. IR2101
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 357.98K  /  6 Page

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    IR2112

International Rectifier
Part No. IR2112
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 379.67K  /  14 Page

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    IR2113

IRF[International Rectifier]
Part No. IR2113
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description HIGH AND LOW SIDE DRIVER

File Size 388.64K  /  14 Page

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    IR2117

IRF[International Rectifier]
Part No. IR2117
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description SINGLE CHANNEL DRIVER

File Size 219.94K  /  7 Page

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    IR2127

International Rectifier
Part No. IR2127
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description CURRENT SENSING SINGLE CHANNEL DRIVER

File Size 187.77K  /  6 Page

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    IR2153

International Rectifier
Part No. IR2153
OCR Text ...of Gate Oxide Connections First layer Second layer Contact Hole Dimension Insulation layer Passivation Method of Saw Method of Die Bond Wire Bond Leadframe Material Width Spacing Thickness Material Width Spacing Thickness Material Thi...
Description SELF-OSCILLATING HALF-BRIDGE DRIVER

File Size 209.66K  /  8 Page

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    IRF7233 ADN8830 SI7904DN FDW2520C FDR6674A FDR840P IRF7401 IRF7404 SI7401DN

AD[Analog Devices]
Part No. IRF7233 ADN8830 SI7904DN FDW2520C FDR6674A FDR840P IRF7401 IRF7404 SI7401DN
OCR Text ...ed for a device soldered in a 4-layer circuit board for surface-mount packages. 883 (Human Body) Model . . . . . . . . . . . . . . . . . . . . . . 1.0 kV *Stresses above those listed under Absolute Maximum Ratings may cause permanent da...
Description Thermoelectric Cooler Controller

File Size 368.92K  /  24 Page

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    LE28F4001M LE28F4001R LE28F4001R-15 LE28F4001R-20 LE28F4001T LE28F4001M-15 LE28F4001T-15 LE28F4001M-20 LE28F4001T-20

SANYO[Sanyo Semicon Device]
Sanyo Electric Co.,Ltd.
Part No. LE28F4001M LE28F4001R LE28F4001R-15 LE28F4001R-20 LE28F4001T LE28F4001M-15 LE28F4001T-15 LE28F4001M-20 LE28F4001T-20
OCR Text ...bricated in a highly reliable 2-layer polysilicon CMOS flash EEPROM process. * Read and write operation from a 5 V single-voltage power supply * Sector erase function: 256 bytes per sector * Fast access time: 150/200 ns * Low power -- Opera...
Description 4MEG (524288words x 8bit) flash memory
4 MEG (524288 words x 8 bits) Flash Memory

File Size 216.11K  /  14 Page

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Price and Availability




 
Price & Availability of layer
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16000: USD0.0357
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TME

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NAC

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