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Molex Electronics Ltd.
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| Part No. |
87911-1811 0879111811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 18 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 18 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.87K /
6 Page |
 View
it Online |
Download Datasheet
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Renesas Electronics Corporation |
| Part No. |
M30879FLAFP
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| Description |
32-bit Microcomputers, , /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-2811 0879112811
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 28 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 28 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
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it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
R0K330879S001BE
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| Description |
Renesas Starter Kit for M32C/87
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-5411 0879115411
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 54 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Right Angle, Through Hole, 54 Circuits, 0.38渭m (15渭) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 54 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
M30879FLFP
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| Description |
32-bit Microcomputers, , /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87911-7811 0879117811
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| Description |
2.54mm (.100) Pitch C-Grid垄莽 Header, Right Angle, Through Hole, 78 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Selective Plating, Tube Packaging, Lead-free
2.54mm (.100) Pitch C-Grid? Header, Right Angle, Through Hole, 78 Circuits, 0.38μm (15μ) Gold (Au) Selective Plating, Tube Packaging, Lead-free
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| File Size |
360.88K /
6 Page |
View
it Online |
Download Datasheet |
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Renesas Electronics Corporation |
| Part No. |
M30879FLBFP
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| Description |
32-bit Microcomputers, , /
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87982-3030 0879823030
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| Description |
2.00mm (.079) Pitch Milli-Grid?/a> Header, Through Hole, Vertical, Shrouded, Lead-free, 30 Circuits, 0.38μm (15μ) Gold (Au) Plating, Center Polarization Slot, without Cap
2.00mm (.079) Pitch Milli-Grid垄芒 Header, Through Hole, Vertical, Shrouded, Lead-free, 30 Circuits, 0.38楼矛m (15楼矛) Gold (Au) Plating, Center Polarization Slot, w
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| File Size |
118.40K /
3 Page |
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it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10087937-002LF
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| Description |
HCI® High Power Connector, Power Supply Connectors, 1x2 Right Angle, HP Header (Guide).
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Official Product Page
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http://
Molex Electronics Ltd.
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| Part No. |
0879331007 87933-1007
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| Description |
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05μm (2μ) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
1.27mm (.050) Pitch Wire-to-Board Header, Dual Row, SMT, Vertical, 10 Circuits, 0.05渭m (2渭) Gold (Au) Plating, Mating Pin Length 1.65mm (0.065), with Cap
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| File Size |
344.32K /
7 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10087937-001LF
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| Description |
HCI® High Power Connector, Power Supply Connectors, 1x2 Right Angle, HP Header (Guide).
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-2216 0879142216
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 22 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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Amphenol Communications Solutions |
| Part No. |
10087939-001LF
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| Description |
HCI® High Power Connector, Power Supply Connectors, 1x2 Vertical, HP Receptacle (Guide).
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
87914-3616 0879143616
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole, Dual Row, Vertical, 36 Circuits, 2.50楼矛m (98.4楼矛) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.41K /
48 Page |
View
it Online |
Download Datasheet |
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SiTime |
| Part No. |
SiT8008AI-12-18E-37.087912
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| Description |
1 to 110 MHz, Low Power Oscillator
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0879143016 87914-3016
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| Description |
2.54mm (.100) Pitch C-Grid? Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50μm (98.4μ) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole, Dual Row, Vertical, 30 Circuits, 2.50渭m (98.4渭) Tin (Sn) Overall Plating, Tray Packaging, Lead-free
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| File Size |
3,779.50K /
48 Page |
View
it Online |
Download Datasheet |
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SiTime |
| Part No. |
SiT8008BC-22-30E-37.087900
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| Description |
1 to 110 MHz, Low Power Oscillator
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| Tech specs |
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Official Product Page
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SiTime |
| Part No. |
SiT8008BC-22-33E-37.087900
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| Description |
1 to 110 MHz, Low Power Oscillator
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| Tech specs |
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Official Product Page
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