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  wtb 1 25mm wafer 180 smt Datasheet PDF File

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    IRFC240

International Rectifier
Part No. IRFC240
Description HEXFET? Power MOSFET Die in wafer Form

File Size 32.63K  /  1 Page

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    IRGCH70KE

International Rectifier
Part No. IRGCH70KE
Description TARGET IRGCH70KE IGBT Die in wafer Form

File Size 18.14K  /  1 Page

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    IRFC2907B IRFP2907

IRF[International Rectifier]
IXYS Corporation
Part No. IRFC2907B IRFP2907
Description HEXFET? Power MOSFET Die in wafer Form
HEXFET Power MOSFET Die in wafer Form

File Size 17.80K  /  1 Page

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    IRLC9024N

International Rectifier
Part No. IRLC9024N
Description HEXFET? Power MOSFET Die in wafer Form

File Size 34.08K  /  1 Page

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    Molex, Inc.
MOLEX INC
Part No. 39-53-2194 39-53-2234 39-53-2044
Description 1.25 FFC ZIF Hsg Assy 19Ckt 19 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
1.25 FFC ZIF Hsg Assy 23Ckt 23 CONTACT(S), FEMALE, RIGHT ANGLE FFC/FPC CONNECTOR, SOLDER
SOCKET, FFC/FPC 1.25mm ZIF 4WAYSOCKET, FFC/FPC 1.25mm ZIF 4WAY; Ways, No. of:4; Pitch:1.25mm; Current rating:1A; Flammability rating:UL94V-0; Material, contact:Phosphor Bronze Alloy; Plating, contact:Tin-Lead; Poles, No. of:4;

File Size 130.71K  /  2 Page

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    MF1ICS7001

NXP Semiconductors
Part No. MF1ICS7001
Description Standard 4Kbyte card IC sawn wafer on UV-tape addendum

File Size 198.83K  /  7 Page

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    VMMK-1218-BLKG VMMK-1218-TR1G

AVAGO TECHNOLOGIES LIMITED
AVAGO TECHNOLOGIES LIMI...
Part No. VMMK-1218-BLKG VMMK-1218-TR1G
Description 0.5 to 18 GHz Low Noise E-PHEMT in a wafer Scale Package

File Size 664.99K  /  12 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
Description Standard Card IC Specification B>bumped sawn wafer on UV-tape

File Size 33.19K  /  7 Page

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    NXP
Part No. SL2ICS2001V1D
Description I-CODE SLI Label IC bumped wafer specification on UV-tape

File Size 198.40K  /  9 Page

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    MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D

NXP Semiconductors
Philips Semiconductors
Part No. MF1ICS5005 MF1ICS5005V1D MF1ICS5005W1D
Description Standard Card IC Specification “bumped sawn wafer on UV-tape”

File Size 31.48K  /  7 Page

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