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MACOM[Tyco Electronics]
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| Part No. |
MA4BN1840-2
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| OCR Text |
...h millimeter frequencies. Large bond pads facilitate the use of low inductance ribbon bonds, while gold backside metalization allows for manual or automatic die attach via 80Au/20Sn or Sn62/Pb36/Ag2 solders or electrically conductive silver... |
| Description |
Monolithic HMIC Integrated Dual Bias Network 18 - 40 GHz
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| File Size |
174.51K /
8 Page |
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http://
MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0002-SMB MAAMGM0002 MAAMGM0002-DIE MAAMGM0002-DIE-SMB
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| OCR Text |
...
0
Figure 4. Die Layout
bond Pad Dimensions
Pad RF: IN, OUT Drain Supply Voltage: VDD Direct Gate Supply Voltage: VGG Select-at-Test Gate Supply Voltage: HI, MID, LO Ground: GND Size (m) 100 x 100 150 x 150 150 x 150 150 x 150 150 ... |
| Description |
Amplifier, Distributed, 0.1W 1.0-18.0 GHz
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| File Size |
181.88K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0003-DIE
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| OCR Text |
...
0
Figure 7. Die Layout
bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG Size (m) 100 x 200 150 x 150 150 x 150 Size (mils) 4x8 6x6 6x6
Specifications subject to change without notice.... |
| Description |
0.4W Variable Distributed Amplifier 1.0 - 15.0 GHz
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| File Size |
265.55K /
7 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAMGM0007-DIE
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| OCR Text |
...e 8. Die Layout
Chip edge to bond pad dimensions are shown to the center of the bond pad.
bond Pad Dimensions
Pad RF In and Out 5 Volt Supply: VD_5 6 Volt Supply: VD_6 7 Volt Supply: VD_7 8 Volt Supply: VD_8 Size (m) 150 x 150 150 x ... |
| Description |
2.0-18.0 GHz Distributed Amp/Gain Block
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| File Size |
315.57K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0016-DIE
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| OCR Text |
...9 m m . 0 0
0 .2 19 m m .
bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage VD1 DC Drain Supply Voltage VD2 DC Gate Supply Voltage VGG 4
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)... |
| Description |
5W Ku-Band Power Amplifier 12.0-15.0 GHz
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| File Size |
262.83K /
5 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0018-DIE
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| OCR Text |
...VD3
0.162mm.
Chip edge to bond pad dimensions are shown to the center of the bond
0.226mm.
1.551mm.
2.576mm.
4.252mm. 4.177mm.
Figure 5. Die Layout
bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage VDD D... |
| Description |
2W Ku-Band Power Amplifier 12.0-15.5 GHz
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| File Size |
327.09K /
6 Page |
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it Online |
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MACOM[Tyco Electronics]
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| Part No. |
MAAPGM0021-DIE
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| OCR Text |
... mm.
Figure 5. Die Layout
bond Pad Dimensions
Pad RF In and Out DC Drain Supply Voltage VDD DC Gate Supply Voltage VGG Size (m) 100 x 200 200 x 150 150 x 150 Size (mils) 4x8 8x6 6x6
Specifications subject to change without notice.... |
| Description |
2W C/X-Band Power Amplifier 4.5-9.0 GHz
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| File Size |
400.80K /
6 Page |
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it Online |
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