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  01580 Datasheet PDF File

For 01580 Found Datasheets File :: 142+       Page :: | 1 | 2 | 3 | 4 | 5 | 6 | 7 | 8 | 9 | 10 | 11 | 12 | <13> | 14 | 15 |   

    A-70567-0283 0015800269

Molex Electronics Ltd.
Part No. A-70567-0283 0015800269
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.38K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015803AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    A-70567-0215 0015800267

Molex Electronics Ltd.
Part No. A-70567-0215 0015800267
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 26 Circuits

File Size 1,218.31K  /  7 Page

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Renesas Electronics Corporation

Part No. R7F7015804AFP-C
Description High-end Automotive Microcontrollers Ideal for Body Applications
Tech specs    

Official Product Page

    A-70567-0285 15-80-0309 0015800309

Molex Electronics Ltd.
Part No. A-70567-0285 15-80-0309 0015800309
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 30 Circuits, 0.38μm (15μ) Gold, (Au) Selective Plating

File Size 1,218.34K  /  7 Page

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    70567-0009 0015800221

Molex Electronics Ltd.
Part No. 70567-0009 0015800221
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 22 Circuits, Tin (Sn) Plating

File Size 1,218.41K  /  7 Page

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    15-80-0087 0015800087 A-70567-0206

Molex Electronics Ltd.
Part No. 15-80-0087 0015800087 A-70567-0206
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 8 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.48K  /  7 Page

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    ONSEMI[ON Semiconductor]
Part No. MC1015802 MC10158FN MC10158L MC10158P MC10158 MC10158-D
Description Quad 2-Input Multiplexer (Non-Inverting)

File Size 84.58K  /  4 Page

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    Bourns Inc.
Bourns, Inc.
Part No. CD0805-S0175R CD0805-S0180R CD1206-S01575R CD0805-S01580R CD1206-S01580R CD1206-S0180R CD1206-S0175R
Description Switching Chip Diode Series 交换芯片二极管系

File Size 286.54K  /  6 Page

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    A-70567-0006 0015800161 15-80-0161 705670006

Molex Electronics Ltd.
Part No. A-70567-0006 0015800161 15-80-0161 705670006
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 16 Circuits, Tin (Sn) Plating

File Size 1,218.39K  /  7 Page

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    15-80-0141 A-70567-0005 0015800141 705670005

Molex Electronics Ltd.
Part No. 15-80-0141 A-70567-0005 0015800141 705670005
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 14 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.38K  /  7 Page

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    15-80-0121 A-70567-0004 0015800121 705670004

Molex Electronics Ltd.
Part No. 15-80-0121 A-70567-0004 0015800121 705670004
Description 2.54mm (.100) Pitch C-Grid? Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid庐 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
2.54mm (.100) Pitch C-Grid垄莽 Header, Through Hole without Peg, Dual Row, Vertical, Shrouded, High Temperature, 12 Circuits, Tin (Sn) Plating
Molex Electronics Ltd.

File Size 1,218.42K  /  7 Page

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