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  55755-1119 Datasheet PDF File

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    1511195008

Molex Electronics Ltd.
Part No. 1511195008
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-201LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

HUA FENG CIRCUIT





    1511193010

Molex Electronics Ltd.
Part No. 1511193010
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-001
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511194008

Molex Electronics Ltd.
Part No. 1511194008
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-101
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511194020

Molex Electronics Ltd.
Part No. 1511194020
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-191
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511194016

Molex Electronics Ltd.
Part No. 1511194016
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-201
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array
Tech specs    

Official Product Page

    1511193012

Molex Electronics Ltd.
Part No. 1511193012
Description 2.00mm Pitch Milli-Grid Header, Through Hole, Dual Row, Right Angle, 2.00μm Tin Plating

File Size 51.54K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-001LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    0520431119 52043-1119

http://
Molex Electronics Ltd.
Part No. 0520431119 52043-1119
Description 1.00mm (.039) Pitch FFC/FPC Connector, Through-Hole, Right Angle, ZIF, BottomContact Style Receptacle, 11 Circuits, Lead-free

File Size 126.79K  /  3 Page

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Amphenol Communications Solutions

Part No. 55755-191LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    Pulse Engineering, Inc.
Part No. H1043T H1015T H1013T H1119T
Description
File Size 248.33K  /  2 Page

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Amphenol Communications Solutions

Part No. 55755-101LF
Description 240 Position BGA Receptacle, 6mm Component Height, 1.27mm x 1.27mm Array, Lead-free
Tech specs    

Official Product Page

    0737711190 73771-1190

Molex Electronics Ltd.
Part No. 0737711190 73771-1190
Description 2.00mm (.079) Pitch HDM? Board-to-Board Stacking Header, High Rise Vertical,SMC, Press-Fit, Guide Pin Option, 144 Circuits
MOLEX Connector

File Size 143.21K  /  4 Page

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Texas Instruments

Part No. TLV7111930DSER
Description Dual, 200mA, Low-IQ, Low-Dropout Regulator for Portable Devices 6-WSON -40 to 125
Tech specs    

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Official Product Page

    0009061119

Molex Electronics Ltd.
Part No. 0009061119
Description MOLEX Connector

File Size 210.92K  /  14 Page

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Texas Instruments

Part No. TLV7111930DSET
Description Dual, 200mA, Low-IQ, Low-Dropout Regulator for Portable Devices 6-WSON -40 to 125
Tech specs    

Official Product Page

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