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  m-die Datasheet PDF File

For m-die Found Datasheets File :: 21705    Search Time::2.141ms    
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    5SMY12J1200

The ABB Group
Part No. 5SMY12J1200
OCR Text ...l / Ti / Ni / Ag 4 1.2 mm mm mm m m m LxW front (E) back (C) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033. Outline drawing 10.18 0.05 9.06 Note: all...
Description IGBT-Die

File Size 63.56K  /  5 Page

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    5SMX12L2510

The ABB Group
Part No. 5SMX12L2510
OCR Text ...1 + TiNiAg 4 1.8 + 1.2 mm mm mm m m m LxW front (E) back (C) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033. Outline drawing G Emitter Note: all di...
Description IGBT-Die

File Size 78.25K  /  5 Page

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    5SMX12L1273

The ABB Group
Part No. 5SMX12L1273
OCR Text ...l / Ti / Ni / Ag 4 1.8 mm mm mm m m m LxW front (E) back (C) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033. Outline drawing G Emitter Note: all di...
Description IGBT-Die

File Size 64.43K  /  5 Page

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    5SMX12K1273

ABB, Ltd.
The ABB Group
ABB Semiconductors
Part No. 5SMX12K1273
OCR Text ...l / Ti / Ni / Ag 4 1.8 mm mm mm m m m LxW front (E) back (C) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033. Outline drawing G Emitter Note: all di...
Description IGBT-Die 75 A, 1200 V, N-CHANNEL IGBT

File Size 64.60K  /  5 Page

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    5SMX12E1273

The ABB Group
Part No. 5SMX12E1273
OCR Text ...l / Ti / Ni / Ag 4 1.8 mm mm mm m m m LxW front (E) back (C) For assembly instructions refer to : IGBT and Diode chips from ABB Switzerland Ltd, Semiconductors, Doc. No. 5SYA 2033. Outline drawing Emitter G Note: all di...
Description IGBT-Die

File Size 64.19K  /  5 Page

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    AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586

Analog Devices, Inc.
AD[Analog Devices]
Part No. AD586 AD586A AD586AR AD586B AD586BR AD586J AD586JCCHIPS AD586JCHIPS AD586JN AD586JQ AD586JR AD586K AD586KN AD586KQ AD586KR AD586L AD586LQ AD586LR AD586M AD586MN AD586S AD586SQ AD586T AD586TQ AD586LN
OCR Text M Grade) Trimmed Temperature Coefficient: 2 ppm/ C max, 0 C to +70 C (M Grade) 5 ppm/ C max, -40 C to +85 C (B & L Grades) 10 ppm/ C max, -5...die level for AD586JCHIPS. These die are probed at 25 C A IN = +15 V unless otherwise noted) AD586J...
Description High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDIP8
High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, CDIP8
High Precision 5 V Reference 1-OUTPUT THREE TERM VOLTAGE REFERENCE, 5 V, PDSO8
High Precision 5 V Reference 高精 V参

File Size 196.90K  /  8 Page

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    AN-1029

Fairchild Semiconductor
Part No. AN-1029
OCR Text ...t u o y a l d a p g n i t n u o m r e p p o c z o 2 n i ( a e r a 2 ) n o t n e m e c a l p e v i t a l e r d r a o b 6 - 11 , 6 7 . 0 , 2 5...die to the die attach pad, through the lead frame to the surrounding case material, to the printed c...
Description Maximum Power Enhancement Techniques for SO-8 Power MOSFETs

File Size 256.51K  /  13 Page

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    DD400S45KL3B5

Infineon Technologies AG
Part No. DD400S45KL3B5
OCR Text .../perswitch r aa'+cc' 0,37 m w h?chstzul?ssigesperrschichttemperatur maximumjunctiontemperature wechselrichter,brems-chopper/inve...dieindiesemproduktdatenblattenthaltenendatensindausschlie?lichfrtechnischgeschultesfachpe...
Description Technische Information / Technical Information

File Size 586.64K  /  7 Page

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    G750

Allen-Bradley
Part No. G750
OCR Text MobileView Guard G750 Beruhrungstastatur mit Ziffern-, Funktions- und Navigationstasten und alphanumerische Bildschirm-Tastatur * Option...die Gesamtkosten durch schnellere Einrichtung und kurzere Umrustzeiten. Die Sicherheitsfunktionen um...
Description MobileView Guard

File Size 66.55K  /  2 Page

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    AN-1028

Fairchild Semiconductor
Part No. AN-1028
OCR Text ...t u o y a l d a p g n i t n u o m r e p p o c z o 2 n i ( a e r a 2 ) n o t n e m e c a l p e v i t a l e r d r a o b 6 - 11 , 6 7 . 0 , 3 5...die to the die attach pad, through the lead frame to the surrounding case material, to the printed c...
Description Maximum Power Enhancement Techniques for SOT-223 Power MOSFETs

File Size 255.38K  /  12 Page

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