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  K6R1016V1C-I12 Datasheet PDF File

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    ST Microelectronics
Part No. STEVAL-MKI126V2
Description MEMS microphone evaluation board based on STA321MPL and MP34DB01 (microphone processor digital uPhone MEMS)

File Size 293.10K  /  8 Page

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HUA FENG CIRCUIT





    RPI-122 A5800739 RPI122

Rohm CO.,LTD.
Part No. RPI-122 A5800739 RPI122
Description Photointerrupter/ double-layer mold type
PHOTOINTERRUPTER, DOUBLE-LAYER MOLD TYPE
From old datasheet system

File Size 80.24K  /  3 Page

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    STEVAL-MKI120V1

STMicroelectronics
Part No. STEVAL-MKI120V1
Description LPS331AP adapter board for a standard DIL24 socket

File Size 104.04K  /  4 Page

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    STEVAL-MKI126V3

STMicroelectronics
Part No. STEVAL-MKI126V3
Description STSmartVoice demonstration board

File Size 553.43K  /  9 Page

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    STEVAL-MKI123V1

STMicroelectronics
Part No. STEVAL-MKI123V1
Description LSM330D adapter board for a standard DIL 24 socket

File Size 226.25K  /  4 Page

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    ST Microelectronics
Part No. STEVAL-MKI124V1
Description L3GD20, LSM303DLHC and LPS331AP 10-axis module designed to be plugged into a standard DIL 24 socket

File Size 162.58K  /  4 Page

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    ST Microelectronics
Part No. STEVAL-MKI127V1
Description Ultra stable 3-axis gyro based on the L3GD20

File Size 212.26K  /  4 Page

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    STEVAL-MKI126V1

STMicroelectronics
Part No. STEVAL-MKI126V1
Description STSmartVoice demonstration board

File Size 581.51K  /  9 Page

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    VIO125-12P1 VID125-12P1 VDI125-12P1

IXYS[IXYS Corporation]
IXYS, Corp.
Part No. VIO125-12P1 VID125-12P1 VDI125-12P1
Description IGBT Modules: Boost Configurated IGBT Modules
IGBT Modules 138 A, 1200 V, N-CHANNEL IGBT

File Size 110.07K  /  4 Page

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    STEVAL-MKI124V1

STMicroelectronics
Part No. STEVAL-MKI124V1
Description L3GD20, LSM303DLHC and LPS331AP 10-axis module designed to be plugged into a standard DIL 24 socket

File Size 255.69K  /  4 Page

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Part: K6R1016V1C-TC12
Maker: SAMSUNG(三星)
Pack: TSSOP44
Stock: 100
Unit price for :
    50: $3.60
  100: $3.42
1000: $3.24

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