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180MB A100K PVO402P 7001C MM1102 ISL8723 MAN74A K246Y
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  thin-chip Datasheet PDF File

For thin-chip Found Datasheets File :: 9906    Search Time::1.765ms    
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    NXP
Part No. LPC4357
OCR Text ...sot740-2 lpc4357fet180 tfbga180 thin fine-pitch ball grid array package; 180 balls sot570-3 lpc4357fbd208 lqfp208 plastic low profile quad ...chip select 0 signal. i usb0_pwr_fault ? port power fault signal indicating overcurrent condition;...
Description (LPC4333 - LPC4357) 32-bit ARM Cortex-M4/M0 MCU

File Size 2,792.79K  /  150 Page

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    AL10051N2DL AL10052N2DL AL10053N9DL AL10055N9DL AL10052N9DL AL10051N9DL AL10052N3DL AL10050N8DL AL10054N7DL AL10052N7DL

ABC Taiwan Electronics Corp
Part No. AL10051N2DL AL10052N2DL AL10053N9DL AL10055N9DL AL10052N9DL AL10051N9DL AL10052N3DL AL10050N8DL AL10054N7DL AL10052N7DL AL10051N7DL AL10053N7DL AL10051N1DL AL10052N6DL AL10053N0DL AL10053N4DL AL10052N4DL AL10050N2DL AL10052N5DL AL10052N1DL AL10053N2DL AL10051N4DL AL10053N3DL AL10053N5DL AL10051N3DL AL10051N0DL AL10051N5DL AL10053N1DL AL10053N6DL AL10050N4DL AL10051N8DL AL10052N0DL AL10052N8DL AL10051N6DL
OCR Text THIN FILM CHIP INDUCTOR ABC'S ITEM NO. CONFIGURATION & DIMENSIONS A D D C B I G ( PCB Pattern ) I Unit : m/m Series AL1005 A 1.000.05 B 0.500.05 C 0.320.05 D 0.200.10 G 0.5 H 0.6 H I 0.45 ...
Description THIN FILM CHIP INDUCTOR

File Size 89.42K  /  6 Page

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    HMC-ALH310

Hittite Microwave Corporation
Part No. HMC-ALH310
OCR Text ...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description GaAs HEMT LOW NOISE AMPLIFIER, 37 - 42 GHz

File Size 188.72K  /  6 Page

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    AD7811 AD7811YN AD7811YR AD7811YRU AD7812 AD7812YN AD7812YR AD7812YRU

AD[Analog Devices]
Part No. AD7811 AD7811YN AD7811YR AD7811YRU AD7812 AD7812YN AD7812YR AD7812YRU
OCR Text ...ine IC (SOIC) and in a 16-lead, Thin Shrink Small Outline Package (TSSOP). The AD7812 is available in a small, 20-lead 0.3" wide, plastic du...chip track/hold amplifier, a 2.5 V on-chip reference and a high speed serial interface that is compa...
Description 2.7 V to 5.5 V, 350 kSPS, 10-Bit 4-/8-Channel Sampling ADCs
2.7 V to 5.5 V 350 kSPS 10-Bit 4-/8-Channel Sampling ADCs

File Size 199.84K  /  20 Page

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    Honeywell Sensing
Part No. AWM2000 AWM1000
OCR Text ...re technology. It consists of a thin-film, thermally isolated bridge structure containing heater and temperature sensing elements. The bridg...chip. Dual sensing elements positioned on both sides of a central heating element indicate flow dire...
Description (AWM Series) Airflow Sensors

File Size 318.49K  /  2 Page

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    HMC-ALH311

Hittite Microwave Corporation
Part No. HMC-ALH311
OCR Text ...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description GaAs HEMT MMIC LOW NOISE DRIVER AMPLIFIER, 22.0 - 26.5 GHz

File Size 190.50K  /  6 Page

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    NXP Semiconductors N.V.
Part No. PLC18V8ZIADH PLC18V8ZIDB PLC18V8Z25A PLC18V8ZIAA PLC18V8ZIDH PLC18V8Z35A PLC18V8Z25DH PLC18V8Z25N PLC18V8ZIA PLC18V8Z25DB PLC18V8Z35D PLC18V8Z35DB PLC18V8Z35DH PLC18V8Z35N PLC18V8ZIADB PLC18V8ZIAN PLC18V8ZIN PLC18V8ZZID
OCR Text ...rink small outline), and tssop (thin shrink small outline) packages ? functional replacement for series 20 pal devices i ol = 24ma ? up to...chip carrier f0 f1 f2 f3 f4 f5 f6 f7 v cc i9/ oe i0/ clk i1 i2 i3 i4 i5 i6 i7 i8 gnd pin description...
Description 20 Characters x 4 Lines, 5x7 Dot Matrix Character and Cursor
Zero standby power CMOS versatile PAL devices OT PLD, 25 ns, PQCC20
Zero standby power CMOS versatile PAL devices OT PLD, 40 ns, PDSO20
Zero standby power CMOS versatile PAL devices OT PLD, 25 ns, PDSO20

File Size 219.44K  /  23 Page

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    HMC383

Hittite Microwave Corporation
Part No. HMC383
OCR Text ...n 0.127mm (5 mil) thick alumina thin film substrates are recommended for bringing RF to and from the chip (Figure 1). If 0.254mm (10 mil) thick alumina thin film substrates must be used, the die should be raised 0.150mm (6 mils) so that the...
Description GAAS PHEMT MMIC MEDIUM POWER AMPLIFIER, 12 - 30 GHZ

File Size 329.93K  /  8 Page

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    PHILIPS
Part No. P89V51RD2FN
OCR Text ... chip carrier; 44 leads plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm plastic leaded chip carrier; 44 leads plastic thin quad flat package; 44 leads; body 10 x 10 x 1.0 mm plastic dual in-line package; 40 leads (600 mil) p...
Description P89V51RB2/RC2/RD2; 8-bit 80C51 5 V low power 16/32/64 kB Flash microcontroller with 1 kB RAM

File Size 328.84K  /  78 Page

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