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				Seoul Semiconductor
Part No.	SAWX4A0X
OCR Text	...rt may shift and excess solder paste may form solder balls which can create electrical s horts between internal pads on the package (figure 4). 1.4 junction temperature the life time of the acriche a4 emitter is most directly related to t...
Description	Designing with Acriche A4 Connect using a siple diode bridge directly to AC power
File Size	1,714.53K / 22 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ECMF06-6AM16
OCR Text	...d 022284 rev 2 13/16 5.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. u...
Description	Common mode filter with ESD protection for MIPI D-PHY and MDDI interface
File Size	263.25K / 16 Page	View it Online	Download Datasheet

				STMicroelectronics
Part No.	ESDAVLC6-1BV2
OCR Text	...ncil window position 4.2 solder paste 1. use halide-free flux, qualification rol0 according to ansi/j-std-004. 2. ?no clean? solder paste recommended. 3. offers a high tack force to resist component displacement during pcb movement. 4. s...
Description	Bidirectional device
File Size	108.35K / 9 Page	View it Online	Download Datasheet

				Wurth Elektronik GmbH & Co. KG, Germany.
Part No.	82357050560
OCR Text	...yout (unit : mm) 1 - the solder paste shall be printed in a thicknes s of 150 to 200 m. 2 - the sir test of the solder paste shall be done based on jis-z-3284 3 - ir reflow pb free process suggestin profile (ba sed on j-std-020-c): spezi...
Description	40402 ESD Suppressor
File Size	346.73K / 4 Page	View it Online	Download Datasheet

				Wurth Elektronik GmbH & Co. KG, Germany.
Part No.	82357050220
OCR Text	...yout (unit : mm) 1 - the solder paste shall be printed in a thicknes s of 150 to 200 m. 2 - the sir test of the solder paste shall be done based on jis-z-3284 3 - ir reflow pb free process suggestin profile (ba sed on j-std-020-c): spezi...
Description	0402 ESD Suppressor
File Size	346.73K / 4 Page	View it Online	Download Datasheet

				AVX Corporation
Part No.	X2A2020RFDCT
OCR Text	...s. control of solder and solder paste volume is critical for surface mount assembly of mlo tm rf devices onto the pcb. stencil thickness and aperture openings should be adjusted according to the optimal solder volume. the following are gene...
Description	The MLOTM SMT RF-DC Crossover is a very low profile crossover that intersects an RF and DC circuit trace in an SMT package.
File Size	461.38K / 4 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGA2706-SM
OCR Text	...e for attachment. follow solder paste and reflow oven vendors? recommendations when dev eloping a solder reflow profile. typical solder reflow profiles are listed in the table below. ? hand soldering is not recommended. solder paste...
Description	2 Watt C-Band Packaged Power Amplifier
File Size	630.68K / 16 Page	View it Online	Download Datasheet

				TriQuint Semiconductor
Part No.	TGA2701-SM
OCR Text	...e for attachment. follow solder paste and reflow oven vendors? recommendations when dev eloping a solder reflow profile. typical solder reflow profiles are listed in the table below. ? hand soldering is not recommended. solder paste...
Description	3 Watt C-Band Packaged Power Amplifier
File Size	748.02K / 16 Page	View it Online	Download Datasheet

				ON Semiconductor
Part No.	NBSG16BAR2
OCR Text	...sk restricts the flow of solder paste on the top of the metallization which prevents the solder from flowing along the side of the metal pad. this is different from the nsmd configuration where the solder will flow around both the top and ...
Description	2.5 V/3.3 V SiGe Differential Receiver/Driver with RSECL Outputs
File Size	41.41K / 4 Page	View it Online	Download Datasheet

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