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Amphenol Communications Solutions |
| Part No. |
69190-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded vertical header, Through Hole, Single Row, 36 Positions, 2.54 mm (0.100in) Pitch.
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| Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
78290-136HLF
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| Description |
BergStik® 2.54mm, Board to Board connector, Unshrouded Header, Through Hole, Single Row, 36 Positions, 2.54 mm Pitch, Vertical, 16.51 mm (0.65in) Mating, 12.7 mm (0.5in) Tail.
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Official Product Page
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Amphenol Communications Solutions |
| Part No. |
68690-136HLF
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| Description |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Through Hole, Double Row, 36 Positions, 2.54 mm (0.100in)Pitch.
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| Tech specs |
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Official Product Page
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Analog Devices |
| Part No. |
ADPA1105ACGZN-R7
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| Description |
1.2-1.4 GHz 35W GaN PA
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| Tech specs |
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Official Product Page
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Molex Electronics Ltd.
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| Part No. |
0901361106 90136-1106
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| Description |
2.54mm (.100) Pitch C-Grid III?/a> Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 6 Circuits, 4μm (160μ) Tin/Lead (Sn) over Nickel (Ni)
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| File Size |
159.23K /
4 Page |
 View
it Online |
Download Datasheet
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Molex Electronics Ltd.
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| Part No. |
0901361318 90136-1318
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| Description |
2.54mm (.100) Pitch C-Grid III?Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
MOLEX Connector
2.54mm (.100) Pitch C-Grid III Header, Single Row, Vertical, Shrouded, 18 Circuits, 0.76μm (30μ) Gold (Au) Selective Plating
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| File Size |
159.40K /
4 Page |
View
it Online |
Download Datasheet |
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Analog Devices |
| Part No. |
ADPA1105ACGZN
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| Description |
1.2-1.4 GHz 35W GaN PA
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| Tech specs |
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Official Product Page
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Bom2Buy.com
Price and Availability
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