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Amphenol Communications Solutions |
Part No. |
47743-000LF
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Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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Tech specs |
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Official Product Page
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Microsemi, Corp.
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Part No. |
NE64300
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Description |
TRANSISTOR | BJT | NPN | 20V V(BR)CEO | 150MA I(C) | CHIP 晶体管|晶体管|叩| 20V的五(巴西)总裁| 150毫安一(c)|芯片
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File Size |
334.45K /
5 Page |
View
it Online |
Download Datasheet
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Amphenol Communications Solutions |
Part No. |
54122-124243000LF
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Description |
BergStik®, Board to Board connector, Unshrouded Vertical Stacking Header, Through Hole, Single Row, 24 Positions, 2.54mm (0.100in) Pitch.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
48243-000LF
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Description |
PV® Wire-to-Board Connector System, 2.54mm (0.1inch) Centerline Crimp-to-Wire Receptacle.
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Tech specs |
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Official Product Page
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Amphenol Communications Solutions |
Part No. |
54122-824343000LF
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Description |
BergStik<sup>®<sup>, Board to Board connector, 2.54mm (0.100in), Unshrouded vertical stacking Header, Through Hole, Double Row, 34 Positions
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Tech specs |
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Official Product Page
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Bom2Buy.com
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Price and Availability
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